Abstract: The invention relates to a method for noninvasively characterizing embedded micropatterns which are hidden under the surface of a wafer down to 100 ?m. The micropatterns are identified with reference micropatterns from a previously produced reference library with the aid of their specific ellipsometric parameters.

Abstract: A measurement device, i.e. a metrology tool, and a vehicle are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit, for, e.g., FOUPs in semiconductor manufacturing, an electronic control system with, e.g., a PC, monitor, and keyboard and optionally a vacuum pump is also provided in module frames of the vehicle. The measurement configuration particularly reduces bottleneck situations in equipment qualifying of processing tools during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool. With the possible exception of power supply or operator control, the measurement configuration can operate fully autonomously.

Abstract: The present invention relates to a scribing method for wafers (11), wherein a defined beam (12) is directed onto the wafer (11) by means of a beam generator means (10) so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a wafer mount (31) and a beam generator means (10) by means of which at least one defined beam can be directed onto the wafer (11). The inventive method is distinguished by the by the further step of generating a first radiation pulse having a predeterminable energy density and used to create a comparatively deep pit (18) in the wafer (11). The inventive wafer scribing means is distinguished by the provision that a radiation pulse can be generated by means of which a comparatively deep pit (18) can be created in the wafer (11).

Abstract: A three-dimensional image of a semiconductor device identification pattern is obtained by measuring the distance of at least one sensor to the surface of the semiconductor device. The apparatus includes a source of radiation for deriving the distance from properties of the reflected light. A unit for determining the distance and an image processing unit are used to establish the three-dimensional picture. Positional information can be achieved in a scanning movement from motors being controlled by a control unit. By applying a threshold value, a two-dimensional image is derived and by a pattern recognition algorithm, the identification pattern can be analyzed.

Abstract: The invention relates to a method for noninvasively characterizing embedded micropatterns which are hidden under the surface of a wafer down to 100 ?m. The micropatterns are identified with reference micropatterns from a previously produced reference library with the aid of their specific ellipsometric parameters.

Abstract: A three-dimensional image of a semiconductor device identification pattern is obtained by measuring the distance of at least one sensor to the surface of the semiconductor device. The apparatus includes a source of radiation for deriving the distance from properties of the reflected light. A means for determining the distance and an image processing unit are used to establish the three-dimensional picture. Positional information can be achieved in a scanning movement from motors being controlled by a control unit. By applying a threshold value, a two-dimensional image is derived and by a pattern recognition algorithm, the identification pattern can be analyzed.

Abstract: A processing tool for manufacturing semiconductor devices, e.g. a lithography cluster, has a device transfer area with an optical sensor (e.g. CCD-camera), and an illumination system. A substrate (e.g., a semiconductor wafer, a reticle, or a mask for exposure on the wafer) that is transferred to or from one of its processing chambers can be scanned during its movement at low resolution. Scanning is performed before and after processing in at least one the processing chambers of the processing tool. The images are compared and optionally subtracted from each other. Defects imposed to the substrate due to contaminating particles only during the present processes with sizes larger than 10 &mgr;m are visible on the subtracted image. Defects imposed earlier are diminished as well as structures formed from a mask pattern below 10 &mgr;m. Pattern recognition allows efficient classification of the defects just detected in a processing tool.

Abstract: A metrology device is described which is couplable to a load port of a semiconductor product handling and/or processing tool. The tool encloses a mini-environmental atmosphere and has a load port table for supporting devices to be coupled to the load port. The metrology device contains a housing preserving an inner atmosphere, a coupling region for connecting the inner atmosphere to the mini-environmental atmosphere and a measuring device for measuring a property of a semiconductor product. The metrology device further has a support which is movable by a transport device and which is dimensioned such that the metrology device is self-supporting in a position appropriate for coupling the coupling region to the load port. The metrology device is thereby couplable to the load port without being supported by the load port table.

Abstract: A measurement device, i.e. a metrology tool, and a vehicle are combined to provide a mobile metrology in a fabrication facility. Peripheral equipment such as a device transfer unit, for, e.g., FOUPs in semiconductor manufacturing, an electronic control system with, e.g., a PC, monitor, and keyboard and optionally a vacuum pump is also provided in module frames of the vehicle. The measurement configuration particularly reduces bottleneck situations in equipment qualifying of processing tools during fast ramp-up phases of, e.g., semiconductor manufacturing facilities, thereby saving costs. The construction is based on PGVs or AGVs and allows a fast operation directly at the location of a processing tool. With the possible exception of power supply or operator control, the measurement configuration can operate fully autonomously.

Abstract: The present invention relates to a scribing method for wafers (11), wherein a defined beam (12) is directed onto the wafer (11) by means of a beam generator means (10) so as to remove some wafer material from a wafer region. The invention also relates to a wafer-scribing device including a wafer mount (31) and a beam generator means (10) by means of which at least one defined beam can be directed onto the wafer (11).

Abstract: A metrology device is described which is couplable to a load port of a semiconductor product handling and/or processing tool. The tool encloses a mini-environmental atmosphere and has a load port table for supporting devices to be coupled to the load port. The metrology device contains a housing preserving an inner atmosphere, a coupling region for connecting the inner atmosphere to the mini-environmental atmosphere and a measuring device for measuring a property of a semiconductor product. The metrology device further has a support which is movable by a transport device and which is dimensioned such that the metrology device is self-supporting in a position appropriate for coupling the coupling region to the load port. The metrology device is thereby couplable to the load port without being supported by the load port table.

Abstract: An apparatus and a method for removing an organic material from a semiconductor device are provided. The apparatus has a reactor for enclosing at least one semiconductor device with deposited organic material and for enclosing a fluid having ingredients for removing the organic material. An optical sensor system is placed in such a manner that an emitted optical radiation is transmitted through the fluid. The optical sensor system is connected to a control device, which controls the insertion of at least one of the ingredients according to the detected intensity of the optical radiation transmitted through the fluid. The invention allows for optimization of the amount of at least one of the ingredients used in the process.

Abstract: A wafer marking is disclosed, which is represented by a large number of soft marks incorporated into a surface of a wafer. The soft marks each have a depth of at least 4 &mgr;m, an internal diameter of at least 50 &mgr;m and, in a particularly advantageous manner, a minimum gradient their surface of 0.2. These depressions can be proded, using appropriate technology, with depths of up to &mgr;m.

Abstract: A configuration for the automatic inscription or reinscription of wafers provides the wafers with a marking for identification and for process management during the production of semiconductor components. The wafer must be moved between different stations for the automatic inscription of a wafer in an appropriate device. Considerable transport movements are saved by the integration of a read station in an inscription chamber having a positioning unit for the wafer.