Abstract: A method for a contactless transmission of electrical energy includes providing a leaf fastened to a wall. The leaf is hingedly mounted about a hinge axis. Providing a hinge plate pin. Providing a primary power coil fastened to the wall. Providing a secondary power coil fastened to the leaf. The primary power coil and the secondary power coil are in an inductive operative connection with each another via the hinge plate pin. Detecting an actual secondary power voltage induced in the secondary power coil. Comparing the actual secondary power voltage with a setpoint value of the secondary power voltage. Influencing a primary power applied to the primary power coil based on the comparison of the setpoint value and the actual secondary power voltage. Detecting the primary power required to achieve the setpoint value of the secondary power voltage. Triggering a signal when a predetermined primary power is exceeded.

Abstract: A method for a contactless transmission of electrical energy includes providing a leaf fastened to a wall. The leaf is hingedly mounted about a hinge axis. Providing a hinge plate pin. Providing a primary power coil fastened to the wall. Providing a secondary power coil fastened to the leaf. The primary power coil and the secondary power coil are in an inductive operative connection with each another via the hinge plate pin. Detecting an actual secondary power voltage induced in the secondary power coil. Comparing the actual secondary power voltage with a setpoint value of the secondary power voltage. Influencing a primary power applied to the primary power coil based on the comparison of the setpoint value and the actual secondary power voltage. Detecting the primary power required to achieve the setpoint value of the secondary power voltage. Triggering a signal when a predetermined primary power is exceeded.

Abstract: A method of fabricating semiconductor components having electrodes and terminals. The method includes preparing an undivided semiconductor wafer having at least one pn-junction; etching a grid pattern of grooves into at least one side of the undivided wafer, thereby forming mesas with concave side surfaces and elevations with upper surfaces bounded by closed rounded curves; coating the exposed lateral surfaces of the etched mesas with a passivating layer; metallizing the upper surfaces of these elevations, thereby providing ohmic contacts for the undivided semiconductor wafer; and breaking the undivided semiconductor wafer into individual semiconductor chips along the lines of the etched grooves.

Abstract: A controllable semiconductor component for two current directions comprising a semiconductor wafer having a middle zone of a first conductivity type extending throughout the wafer plane, an upper zone of a second conductivity type adjoining the middle zone from above, a lower zone of the second conductivity type adjoining the middle zone from below, a first main electrode zone of the first conductivity type adjoining a first partial zone on the upper side of the upper zone, a second main electrode zone of the first conductivity type adjoining a first partial zone on the underside of the lower zone, a first control-electrode zone of the second conductivity type on the upper side of the upper zone and at a lateral distance from the first main electrode zone, a second control-electrode zone of the first conductivity type on the upper side of the upper zone and at a distance from the first main-electrode zone and a notch between the control-electrode zones which extends laterally partway between the first partial

Abstract: A method is disclosed for producing semiconductor components by contacting the electrodes of disk-shaped semiconductor chips with at least one pn-junction by means of a comb with contact legs. The method includes bending a strip coated with solder on at least one side into a number of identical sections each having a wing-like profile viewed normal to the length of the strip, laying the side of the winged strip opposite the wings on the top main surfaces of the semiconductor chips and pre-attaching it to them. The method further includes aligning a cooling-fin comb and/or leg comb in a soldering jig, introducing the winged strip with the pre-attached semiconductor chips, soldering the resultant comb system which is held together by pressure on the winged strip, cutting apart the conducting links between the semiconductor electrodes formed by the winged strip, lacquering, baking and encapsulating in plastic the comb system except for the ends of the electrode leads formed by the contact legs.