Abstract: A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof, characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight Mn of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight Mn of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer.

Abstract: The invention relates to hot melt adhesives which are pressure sensitive adhesives whereby the adhesive is provided in a granulated form and is free-flowing and does not block during storage. Such pellets can be used as feed for automated feeder devices for the supply hot melt application systems.

Abstract: The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ?1000 and ?300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.

Abstract: The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200° C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.

Abstract: The invention relates to a nontacky film-forming polymer composition (cover material), and tacky hot melt adhesives in the form of pellets which are coated with the polymer composition and producible by coextruding the hot melt adhesive and the cover material. The film-forming composition comprises 5 to 40% by weight of at least one Fischer-Tropsch wax having a melting point of >95° C. and 30 to 70% by weight of at least one metallocene-catalyzed polyolefin having a softening point of >95° C. and a melt flow index (MFI) (230° C., 2.16 kg) of ?1000 and ?300 g/10 minutes. The invention further relates to suitable uses for such hot melt adhesives, methods for their use, and products containing these adhesives.

Abstract: The invention relates to storage-stable hot-melt adhesive containing 15 to 70 wt % of a mixture of at least one copolymer based on ethylene and/or propylene and at least one C4 to C20 ?-olefin which is obtainable as a block copolymer by metallocene-catalyzed polymerization, and at least one styrene block copolymer, 10 to 70 wt % of at least one tackifying resin, 0 to 40 wt % of further additives, wherein the total of the percentages should amount to 100% and the tackifying resin is entirely or in part a soft resin.

Abstract: A hot-melt adhesive composition is disclosed. The hot melt adhesive comprises a) 25 to 95 wt %, preferably 50 to 85 wt % of at least one polyolefin-based polymer; b) 1 to 75 wt %, preferably 1 to 40 wt % of at least one tackifying resin; c) 0 to 15 wt % of at least one plasticizer; and d) 0 to 30 wt % of at least one additive and/or adjuvant selected from among stabilizers, adhesion promoters, fillers or pigments, waxes, and/or other polymers or combinations thereof, characterized in that the at least one polyolefin-based polymer is a mixture of: a1) at least one first polyolefin-based polymer with a molecular weight Mn of <10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer, and a2) at least one second polyolefin-based polymer with a molecular weight Mn of >10,000 g/mol in a quantity of 20 to 80 wt % with respect to the total quantity of polyolefin-based polymer.

Abstract: The invention relates to a hotmelt adhesive comprising 10 to 40 wt % of at least one branched styrene-isoprene-styrene block copolymer having a weight percentage diblock fraction in the polymer of less than 30% and a melt flow index of less than 5 g/10 minutes at 200° C. under a test load of 5 kg; 0 to 40 wt % of at least one styrene polymer or styrene copolymer; 20 to 60 wt % of at least one tackifying resin; 0 to 15 wt % of at least one plasticizer; and 0 to 16 wt % of additives and auxiliaries selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers. Also included are the use thereof to bond films, and products, especially packaging products, that include this adhesive.

Abstract: The invention relates to hot melt adhesives which are pressure sensitive adhesives whereby the adhesive is provided in a granulated form and is free-flowing and does not block during storage. Such pellets can be used as feed for automated feeder devices for the supply hot melt application systems.

Abstract: The invention relates to storage-stable hot-melt adhesive containing 15 to 70 wt % of a mixture of at least one copolymer based on ethylene and/or propylene and at least one C4 to C20 ?-olefin which is obtainable as a block copolymer by metallocene-catalysed polymerisation, and at least one styrene block copolymer, 10 to 70 wt % of at least one tackifying resin, 0 to 40 wt % of further additives, wherein the total of the percentages should amount to 100% and the tackifying resin is entirely or in part a soft resin.

Abstract: The hot melt pressure-sensitive adhesive (PSA) in the form of a granulate, the granulate comprises a core made of a hot melt pressure-sensitive adhesive and an outer layer, surrounding said core, made of a composition that is not pressure-sensitively adhesive, where the outer layer contains: 5 to 35 wt % of a hydrogenated styrene block copolymer; 20 to 65 wt % of at least one oil; and 0 to 15 wt % additives.

Abstract: Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C3 to C20-?-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100%, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0° C. to 25° C., measured as the ratio of the storage modulus E? according to (E?0C?E?25C)/E?25C<1.5.

Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.

Abstract: Melt adhesive containing 5 to 40 wt.-% of at least one ethylene-based copolymer and at least one C3 to C20 -?-olefin obtained through metallocene-catalyzed polymerization, 10 to 65 wt.-% of at least one tackifying resin, 0 to 35 wt.-% of a plasticizer, 0.01 to 30 wt.-% additives and additional ingredients selected from stabilizers, adhesion promoters, fillers or pigments, waxes and/or other polymers, wherein the total should amount to 100%, characterized in that copolymer A is a block copolymer that exhibits a substantially even elastic behavior in the range of 0° C. to 25° C., measured as the ratio of the storage modulus E? according to (E?0C?E?25C)/E?25C<1.5.

Abstract: A multiple-ply fluid-absorbing hygiene item for use in a garment, the item comprising an outer layer; said outer layer comprising a layer of a UV-crosslinking pressure-sensitive adhesive; the pressure-sensitive adhesive being crosslinked from a liquid pressure-sensitive adhesive precursor by UV radiation; the pressure-sensitive adhesive precursor having, at a temperature of at most 80° C., a viscosity below 5000 mPas.

Abstract: A hot-melt adhesive for resealable packaging, containing 30 to 90 wt. % of at least one copolymer based on ethylene and/or propylene together with C4 to C12-?-olefins, which is obtainable by metallocene-catalyzed polymerization, with a melt index of 5 to 100 g/10 min (DIN ISO 1133), 5 to 50 wt. % of tackifier resins with a softening point of 80 to 140° C., 0 to 15 wt. % of waxes with a melting point of 120 to 170° C., 0.1 to 20 wt. % of additives and auxiliaries, the adhesive having a viscosity of 25,000 mPa·s to 250,000 mPa·s, measured at a temperature of 170 to 190° C.

Abstract: Adhesive systems are useful for bonding wrap-around labels using an overlap adhesive in their application to blown plastic containers, more particularly plastic bottles. The adhesive system includes reactive contact adhesives based on multifunctional macromonomer compounds curable in steps by different reaction mechanisms, which may also be present mixed with one-stage reactive mixture components.

Abstract: The invention is an adhesive system for applying wrap around labels to containers. The system comprises a hotmelt pick-up adhesive which is active at the temperature which the label is applied and loses its bonding ability after the adhesive sets and an overlap adhesive for bonding the label overlap. At its application temperature, the pick-up adhesive has significantly higher adhesiveness, measured at its application temperature than at its conventional storage temperature. In addition, the adhesive preferably has a greater affinity for the label than for the container bearing the label. Consequently, the label can be easily removed from the hollow body without leaving residues of adhesive. If, nevertheless, a residual adhesive should remain on the hollow body, it can be dissolved by an alkaline solution.