Abstract: A device wherein food can be warmed by means of induction, said device comprising at least one secondary coil which is formed from a current conductor, whereon at least one heating element is connected. The invention also relates to a device which is used to transfer energy in a device in order to warm food by means of induction, said device comprising a primary coil which is connected to a voltage source and which is formed from a current conductor. According to the invention, the primary and secondary coil is cast into a coil body by casting means, and the insulating casting means exhibits a coefficient of thermal expansion which essentially corresponds to the coil body.

Abstract: A device for heating food using induction, including a base element having a secondary winding configured from a current conductor and a heating element that is connected to the winding. To reduce the height of the base element, a winding core is located inside the winding. Further, a device for transmitting energy to a device for heating food by induction, the former device including a primary winding that is configured from a current conductor and is connected to a voltage source.

Abstract: At least one electric component, such as a power semiconductor component, has at least a two-phase cooling device having at least one evaporator. The evaporator has a liquefier with a structured liquefier surface for evaporating a cooling fluid, formed by an electric connecting line making electrical contact with an electric contact face of the component. The connecting line cools the power semiconductor component and a module equipped therewith. Isothermal cooling with a low thermal loading of the power semiconductor component or of the module is possible by virtue of the two-phase cooling device acting as an evaporating bath cooling system. The device is applied in the planar contact-making technology with a large surface by providing an electric component with an electric contact face and producing the electric connecting line to the evaporator surface on the contact face of the component.

Abstract: An inductive component, for the formation of a magnetic circuit has at least one wire winding and at least one core with a ferromagnetic core material. The core comprises a gap and at least one further gap to interrupt the magnetic circuit. The inductive component is characterized in that the gaps each have a gap width of at least 1.0 mm. The core comprises two pieces, for example, which are arranged opposed to each other across the gaps and separated from each other by the gap width. The component is advantageously symmetrical with an essentially equal gap width for the gaps. A miniaturized inductive component is possible by the use of a hire winding made from high frequency braided wire and core material capable of accepting high frequencies, which has a high Q-factor even on a high power throughput and thus low electrical losses. In order to increase the Q-factor, the inductive component also has a cooling device for cooling the wire winding.

Abstract: A device wherein food can be warmed by means of induction, said device comprising at least one secondary coil which is formed from a current conductor, whereon at least one heating element is connected. The invention also relates to a device which is used to transfer energy in a device in order to warm food by means of induction, said device comprising a primary coil which is connected to a voltage source and which is formed from a current conductor. According to the invention, the primary and secondary coil is cast into a coil body by casting means, and the insulating casting means exhibits a coefficient of thermal expansion which essentially corresponds to the coil body.

Abstract: A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

Abstract: A circuit arrangement placed on a substrate has at least one semiconductor component arranged on the substrate and having at least one electrical contact surface and at least one connection line also arranged on the substrate and used to electrically contact the contact surface of the semiconductor component. The connection line forms part of a discrete, passive electrical component arranged on the substrate. The electrical contacting of the contact surface of the semiconductor component is carried out during a step of the process and the part of the secrete, passive electrical component is produced. To this end, especially a film consisting of an electrically insulating material is applied to the power semiconductor and to the substrate under a vacuum, and the contact surface of the power semiconductor is then bared. Furthermore, the connection component is carried out and the part of the discrete, passive electrical component is produced.

Abstract: A self-supporting contacting structure is directly produced on a component that does not have a housing by applying a layer made of non conducting material and a layer made of an electrically conductive material to the component and to a support and by subsequently removing these layers from said support.

Abstract: The invention relates to an inductive component (1), for the formation of a magnetic circuit, comprising at least one wire winding (3) and at least one core (4) with a ferromagnetic core material. Said core comprises a gap (7, 8) and at least one further gap (8, 7) to interrupt the magnetic circuit. The inductive component is characterised in that the gaps each have a gap width of at least 1.0 mm. The core comprises two pieces, for example, which are arranged opposed to each other across the gaps (7, 8) and separated from each other by the gap width. The component is advantageously symmetrical with an essentially equal gap width for the gaps. A miniaturised inductive component is possible by the use of a hire winding made from high frequency braided wire and core material capable of accepting high frequencies, which has a high Q-factor even on a high power throughput and thus low electrical losses.

Abstract: A device (4) comprises a container (40) for a liquid coolant (41) that is disposed between the axis (1) and the surface (30) facing the axis to co-rotate with the surface. The device is further provided with an atomizer nozzle (42) of the container, facing the surface, from which the coolant is discharged during rotation of the container due to the centrifugal force (F) acting upon the coolant of the container in the form of an atomized jet (43) that strikes the surface. The device cools a surface of an electronic device (3) that runs hot, the electronic device supplying the X-ray source of a computer tomograph with power and rotating about the axis of the gantry (2) of the tomograph.

Abstract: A device (4) comprises a container (40) for a liquid coolant (41) that is disposed between the axis (1) and the surface (30) facing the axis to co-rotate with the surface. The device is further provided with an atomizer nozzle (42) of the container, facing the surface, from which the coolant is discharged during rotation of the container due to the centrifugal force (F) acting upon the coolant of the container in the form of an atomized jet (43) that strikes the surface. The device cools a surface of an electronic device (3) that runs hot, the electronic device supplying the X-ray source of a computer tomograph with power and rotating about the axis of the gantry (2) of the tomograph.

Abstract: Nine bidirectionally blocking power components are attached on a substrate in the form of a three-row matrix. The power components are attached between three respective current conductors arranged parallel to each other above and below the power components. The current conductors above the matrix proceed at a right angle relative to the current conductors under the matrix. The interconnects to the gate and auxiliary emitter terminals are situated on or in a thin insulating printed circuit board or film and are secured to the corresponding contacts of the chips in recesses of the current conductors.

Abstract: A semiconductor module having a high dissipated power has an electrically insulating and thermally conducting layer of crystalline carbon provided between a semiconductor chip and a heat elimination element, whereby the semiconductor chip, the insulating layer and the heat elimination element are connected via an intermediate layer and via connecting layers of silver by pressure sintering. For low-voltage applications, a layer of amorphous carbon can alternatively be employed instead of the layer of crystalline carbon. Extremely low heat transmission resistance between the semiconductor chip and the heat elimination element is provided.

Abstract: Method and apparatus for analyzing errors or failures in integrated circuits wherein the integrated circuit is displayed on the picture screen of a work station (AS) and the circuit is excited with a test signal such that at least one measuring location is selected on a malfunction path and an actual signal tappable at this measuring location is compared to a rated signal and wherein the fault location is identified from the comparison results at the measuring locations. The object is to execute a method using an electron beam testing apparatus (EMG) such that the simplest possible measured data transfer occurs.

Abstract: A particle probe is positioned to a specific region when an actual position of the specific region appears shifted relative to its rated position due to local fields, and can therefore not be defined with high precision. The particle probe is positioned to a prescribed region. The particle probe is then deflected in the environment of this region such that the particle probe impinges different regions at the prescribed region. The position of the specific region is determined from the measured signals which are triggered given incidence of the particle probe on the different regions. The particle probe is then positioned to the specific region. An electrical line may form a test spot at the specific region wherein one dimension thereof is greater than a width thereof.

Abstract: A method for the contactless measurement of the potential waveform in an electronic component with a scanning electron microscope in which the electron beam is aimed at a measuring point of the integrated circuit until at least one phase range of the measuring voltage is determined by phase-shifting the pulses of the primary electron beam with respect to the measuring voltage and subsequently, the electron beam jumped to at least one further measuring point where a phase range is determined in the same manner permitting measurement of the potential waveform at different points of the integrated circuit and displayed together on a picture screen.

Abstract: A process is provided for the production of pile surfaced products in which the pile is produced by tack spinning thermoplastic polymer composition onto one or both external surfaces, preferably one of a foundation layer which comprises at least two sheets which adhere together using an adhesive having a softening point similar to that of the thermoplastic polymer composition.

Abstract: A pile-surfaced product is made by feeding a synthetic polymeric material and a backing web to a surface with the synthetic polymeric material between the backing web and the surface under conditions where the polymeric material is filament forming and the polymeric material adheres to the surface and bonds to the backing web, then withdrawing the backing web from that surface so that as the backing web is so withdrawn the synthetic polymeric material adheres thereto and is drawn into fibrils due to its adhesion to the surface but the fibrils remain integral with the remainder of the polymeric material which is laminated to the backing web, rendering the polymeric material non-filament forming, separating the fibrils from the surface and subsequently separating the pilous synthetic polymeric layer from the backing web.