Abstract: An improved method for attaching a semiconductor die to a leadframe is provided The improved method comprises forming a patterned adhesive layer on a side of a semiconductor wafer prior to singulation of the dies from the wafer. The adhesive layer is patterned such that wire bonding pads on the dies, as well as the streets between the dies, are free of adhesive material The adhesive layer may be deposited and patterned using a hot or cold screen printing process, by depositing and photopatterning a photosensitive adhesive, or using a resist etch back method. During a packaging process for attaching a die to a leadframe, the adhesive layer is heated and the lead fingers of the leadframe are placed in contact with the die under pressure. In an alternate embodiment of the invention, the lead fingers, rather than a side of the dies, are coated with an adhesive layer.