Patents by Inventor Ed Carmines

Ed Carmines has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • THERMOFORMABLE MULTILAYER FILMS AND BLISTER PACKS PRODUCED THEREFROM
    Publication number: 20230294892
    Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
    Type: Application
    Filed: May 16, 2023
    Publication date: September 21, 2023
    Applicant: Philip Morris USA Inc.
    Inventors: Stephen J BELLAMAH, Ed CARMINES, Rangaraj S. SUNDAR
  • Thermoformable multilayer films and blister packs produced therefrom
    Patent number: 11713171
    Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: August 1, 2023
    Assignee: Philip Morris USA Inc.
    Inventors: Stephen J. Bellamah, Ed Carmines, Rangaraj S. Sundar
  • THERMOFORMABLE MULTILAYER FILMS AND BLISTER PACKS PRODUCED THEREFROM
    Publication number: 20200399037
    Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
    Type: Application
    Filed: September 3, 2020
    Publication date: December 24, 2020
    Applicant: Philip Morris USA Inc.
    Inventors: Stephen J. BELLAMAH, Ed CARMINES, Rangaraj S. SUNDAR
  • Thermoformable multilayer films and blister packs produced therefrom
    Patent number: 10766679
    Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: September 8, 2020
    Assignee: Philip Morris USA Inc.
    Inventors: Stephen J. Bellamah, Ed Carmines, Rangaraj S. Sundar
  • Thermoformable multilayer films and blister packs produced therefrom
    Patent number: 9511914
    Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
    Type: Grant
    Filed: September 1, 2009
    Date of Patent: December 6, 2016
    Assignee: Philip Morris USA Inc.
    Inventors: Stephen J. Bellamah, Ed Carmines, Rangaraj S. Sundar
  • THERMOFORMABLE MULTILAYER FILMS AND BLISTER PACKS PRODUCED THEREFROM
    Publication number: 20150284162
    Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
    Type: Application
    Filed: June 19, 2015
    Publication date: October 8, 2015
    Inventors: Stephen J. Bellamah, Ed Carmines, Rangaraj S. Sundar
  • THERMOFORMABLE MULTILAYER FILMS AND BLISTER PACKS PRODUCED THEREFROM
    Publication number: 20110049003
    Abstract: A multi-layer film structure for use in forming blister packaging. The multi-layer structure includes a first polymeric layer having a first surface and a second surface, the first polymeric layer comprising a metalized polyethylene teraphthalate, a second polymeric layer having a first surface and a second surface, the first surface of the second polymeric layer disposed adjacent the second surface of the first polymeric layer, the second polymeric layer comprising a cyclic olefin or a homopolymer of chlorotrifluoroethylene, and a third polymeric layer having a first surface and a second surface, the first surface of the third polymeric layer disposed adjacent the second surface of the second polymeric layer, the third polymeric layer comprising polypropylene or polyvinyl chloride. A method of making a multi-layer film structure and a packaging structure are also provided.
    Type: Application
    Filed: September 1, 2009
    Publication date: March 3, 2011
    Applicant: PHILIP MORRIS USA INC.
    Inventors: Stephen J. Bellamah, Ed Carmines, Rangaraj S. Sundar