Patents by Inventor Ed Fulcher

Ed Fulcher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package substrate with multiple voltage supplies
    Patent number: 6777802
    Abstract: A semiconductor substrate having multiple signal voltage power supplies is provided. The substrate may include a signal voltage power ring separated into segmented voltage supply connections laterally spaced across the upper surface of the substrate. In addition, the substrate may include a voltage supply plane formed within the substrate. The voltage supply plane may be separated into segmented planes. Vias may electrically connect the segmented voltage supply connections to the segmented planes. In an embodiment, at least 2 of the segmented planes may have different voltage supplies. For example, each of the segmented voltage supply connections are configurable to supply power to a portion of input/output drivers of an integrated circuit. Voltage supplies of the segmented planes may be determined based on voltage requirements of the portions of the input/output drivers.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: August 17, 2004
    Assignee: LSI Logic Corporation
    Inventors: Leonard L. Mora, Abi Awujoola, Ed Fulcher