Patents by Inventor Ed Prack

Ed Prack has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8138239
    Abstract: In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: March 20, 2012
    Assignee: Intel Corporation
    Inventors: Ed Prack, Yi Li, Wei Wu
  • Publication number: 20100159233
    Abstract: In some embodiments, polymer thermal interface materials are presented. In this regard, a thermal interface material is introduced comprising a polymer matrix, a matrix additive, wherein the matrix additive comprises a fluxing agent, and a spherical filler material, wherein the spherical filler material comprises a metallic core with an organic solderability preservative coating. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: December 23, 2008
    Publication date: June 24, 2010
    Inventors: Ed Prack, Yi Li
  • Publication number: 20100155935
    Abstract: Methods for coating a protective material on a semiconductor substrate to protect a back surface thereof from defects are provided, by depositing a diamond-like coating (DLC) material thereon at a low temperature, e.g. between about 150° C. to about 350° C.
    Type: Application
    Filed: December 23, 2008
    Publication date: June 24, 2010
    Inventors: Ed Prack, Leonel Arana, Sandeep Razdan