Abstract: A camera module includes an actuator coupled to one or more movable lenses of an optical train and configured to move the one or more lenses relative to the image sensor to provide zoom or autofocus or both to the camera module. The actuator is configured to bias one or more pairs of actuator components, and to measure one or more capacitances of the one or more pairs of actuator components, and to determine an orientation of the camera module based on the one or more measured capacitances, and to provide information accordingly for the actuator to step through an auto-focus process that is specifically tailored to one of multiple sub-ranges of camera pointing angles.

Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Abstract: A compact camera module has an EMI housing configured to shield camera module components from electromagnetic interference and having defined therein a focus-adjustment aperture to permit an optical train to extend to at one end of an auto-focus range, and a light leak baffle partially overlaps the focus-adjustment aperture along the optical path outside the auto-focus range.

Abstract: A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.

Abstract: An interior housing of a compact camera module is insulated from external shocks in a direction along the optical path to an external housing that is spaced from the interior housing by a compression distance of one or more shock absorbing sponges that are disposed between the outer housing and the interior housing and that are configured to compress to absorb external physical shocks in two or three spatial dimensions.

Abstract: An interior housing of a compact camera module is insulated from external shocks in a direction along the optical path to an external housing that is spaced from the interior housing by a compression distance of one or more shock absorbing sponges that are disposed between the outer housing and the interior housing and that are configured to compress to absorb external physical shocks in two or three spatial dimensions.

Abstract: A compact camera module is coupled at an image sensor end to a flexible printed circuit (FPC) and an FPC extension segment and is configured such that, upon folding the FPC onto the housing, one or more electrical contact pads disposed on the subject side of the optical train are coupled electrically with contact pads on the FPC extension segment from which MEMS actuator control signals are transmittable directly from the FPC to the MEMS lens actuator.

Abstract: A compact camera module includes a housing with an interior framework or separate interior bracket that has a conductive trace that runs along one or more surfaces thereof and electrically connects a lens actuator to a printed circuit to carry auto-focus control signals to the lens actuator from the printed circuit.

Abstract: A compact camera module has an EMI housing configured to shield camera module components from electromagnetic interference and having defined therein a focus-adjustment aperture to permit an optical train to extend to at one end of an auto-focus range, and a light leak baffle partially overlaps the focus-adjustment aperture along the optical path outside the auto-focus range.

Abstract: An interior housing of a compact camera module is insulated from external shocks in a direction along the optical path to an external housing that is spaced from the interior housing by a compression distance of one or more shock absorbing sponges that are disposed between the outer housing and the interior housing and that are configured to compress to absorb external physical shocks in two or three spatial dimensions.

Abstract: A camera module includes an actuator coupled to one or more movable lenses of an optical train and configured to move the one or more lenses relative to the image sensor to provide zoom or autofocus or both to the camera module. The actuator is configured to bias one or more pairs of actuator components, and to measure one or more capacitances of the one or more pairs of actuator components, and to determine an orientation of the camera module based on the one or more measured capacitances, and to provide information accordingly for the actuator to step through an auto-focus process that is specifically tailored to one of multiple sub-ranges of camera pointing angles.

Abstract: A camera module includes an actuator coupled to one or more movable lenses of the optical train and configured to move the one or more lenses relative to the image sensor to provide zoom or autofocus or both to the camera module. The actuator is configured to position one or more lenses of the optical train by applying one or more bias voltages respectively between one or more pairs of actuator components. The camera module processor is configured to determine an orientation of the camera module for the actuator to step through an auto-focus process that is specifically tailored to one of multiple sub-ranges of camera pointing angles relative to vertical.

Abstract: A miniature camera module component is formed by creating replicated lens shapes on a protective cover wafer and depositing material to form multiple cavities with the replicated lens shapes respectively disposed therein. A carrier wafer is coupled to the protective cover wafer before it is diced. An intermediate wafer is coupled to the protective cover wafer, and the carrier wafer is removed. An image sensor wafer is coupled to the protective cover wafer, and the intermediate wafer is removed.

Abstract: An optical element which includes an optical block having a cavity part formed on an optical path and an inclined face formed in an internal face of the cavity part at a prescribed inclining angle with respect to a traveling direction of light. Multilayer films of the same structure are formed at least on the internal face of the cavity part and on an interface between a light incident end and/or emission end of the optical block and outside. The multilayer film formed on the incline face in the internal face of the cavity part has at least a wavelength selecting function for light to be used.

Abstract: There is provided an optical element which can achieve more reduction in the number of components, downsizing, low cost, and an improvement in the mass-productivity while maintaining an excellent optical property. The optical element comprises: an optical block having a cavity part formed on an optical path and an inclined face formed in an internal face of the cavity part at a prescribed inclining angle with respect to a traveling direction of light, wherein multilayer films of the same structure are formed at least on the internal face of the cavity part and on an interface between light incident end and/or emission end of the optical block and outside. The multilayer film formed on the inclined face in the internal face of the cavity part has at least a wavelength selecting function for light to be used, and the multilayer film formed on other face than the inclined face has an antireflective function for light to be used.