Patents by Inventor Eddy Alberic Joseph BLANSAER

Eddy Alberic Joseph BLANSAER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A HEAT-SINK LEAD FRAME
    Publication number: 20210118778
    Abstract: According to an aspect, a semiconductor package includes a semiconductor die having a first surface and a second surface opposite to the first surface, a lead frame coupled to the second surface of the semiconductor die, and a heat-sink lead frame coupled to the first surface of the semiconductor die, where the semiconductor die is disposed between the lead frame and the heat-sink lead frame, and the heat-sink lead frame is configured to transfer heat away from the semiconductor die.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 22, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventor: Eddy Alberic Joseph BLANSAER