Abstract: An automated method of cleaning trays used in handling circuit device packages includes the steps of: placing a plurality of trays on a tray loading station of an automated tray cleaning machine; lowering in an automated manner a first tray of the plurality of trays onto a conveyor; conveying in an automated manner the first tray from the tray loading station into a cleaning chamber; automatically applying pressurized air in the cleaning chamber to one or more surfaces of the first tray to remove debris from the first tray; conveying in an automated manner the first tray out of the cleaning chamber and to a tray unloading station; and raising in an automated manner the first tray above the conveyor.

Abstract: An automated system cleans trays used in handling circuit device packages is provided in a sequential manner with pressurized air in a cleaning chamber, and a vacuum system is operated to remove the contamination (e.g. metal fibers) from the cleaning chamber. The system can convey trays in a sequential manner from one or more stacks of trays at associated tray loading stations into one or more associated cleaning chambers, and convey the cleaned trays from the one or more cleaning chambers to one or more associated tray unloading stations, where the cleaned trays are stacked. The system can handle approximately 30,000 trays per day.