Abstract: Fluid ejection head assemblies, fluid ejection devices, and methods for improving fluid sealing of fluid ejection head assemblies. One such fluid ejection head assembly includes a substrate cavity and a substantially planar surface surrounding the substrate cavity. The substantially planar surface contains at least one external vent, at least one internal vent channel, and a plurality of vents in fluid flow communication with the substrate cavity and providing fluid flow communication between the internal vent channel and the external vent. The plurality of vents, the at least one external vent and the at least one internal vent channel are disposed in fluid flow communication with an environment external to the substrate cavity for flow of a gas associated with an adhesive at least partially disposed in the substrate cavity, to the environment during the curing of the adhesive.

Abstract: Methods and apparatuses for applying a protective material to an interconnect associated with a component. One such method involves placing a stencil in close proximity to an interconnect that extends over a cavity. An amount of protective material is placed on the stencil. A wiper is passed across the stencil. The wiper has an angle of attack of less than 50 degrees. At least a desired thickness of protective material is applied to the interconnect.