Abstract: The invention relates to a process for producing an enamel baked molded component made from a double-layer plate comprising two cover plates with an intermediate epoxy resin layer that is glued to the cover plates. The process comprises introducing the epoxy resin between the cover plates prior to its polymerization to maintain an adhesive connection between the cover plates and the intermediate layer, while at the same time allowing for deformation of the double-layer plate by deep-drawing in particular without subjecting the cover plates to excessive stress. The epoxy resin that is used polymerized exclusively at the enamel baking temperatures, being coherent but not polymerized when the double-layer plate is deformed, while the enamel layer is baked only after the deformed component is lacquered, whereby said baking occurs at a temperature at which polymerization of the epoxy resin of the intermediate layer also occurs.