Abstract: The invention relates to a resonator operating with bulk acoustic waves (BAW resonator, BAW=Bulk Acoustic Wave) and band-pass filters constructed of such resonators. To increase the edge steepness of the transmission band of a BAW band-pass filter, the invention proposes reducing the effective coupling of a BAW resonator by using the connection in parallel of a BAW resonator and a capacitor instead of only one resonator. In addition, to increase the edge steepness of the transmission band, the use of a connection of coupled BAW resonators in the serial branch of a filter circuit with another resonator or resonator stack in the parallel branch of the filter circuit is proposed, the additional resonator or resonator stack being connected to the center electrode of the resonator stack specified initially.

Abstract: The invention relates to a front-end circuit, suitable for a plurality of mobile wireless systems, for separating different frequency bands. According to the invention, separation of the frequency bands occurs by means of band-pass filters connected in parallel signal paths and executed on the basis of thin-layer resonators, which, as a result of their high quality, allow for a high degree of selection between the frequency bands.

Abstract: A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.

Abstract: A component working with acoustic bulk waves is provided that has a multi-layer substrate, where the multi-layer substrate comprises an integrated matching network and further circuit elements for adapting the electrical filter properties and can serve as carrier substrate for thin-film resonators.

Abstract: A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.

Abstract: Overlapped electrodes of an electrical component are dimensioned in such a way that when there is translational displacement of one electrode in relation to the electrode situated opposite, their area of overlap remains within a manufacturing tolerance ?/2, and also remains constant within the tolerance limits when there is a simultaneous rotation of the electrodes with respect to one another. This is achieved in that the intersecting edge pairs of the overlapping electrodes are designed parallel to one another, whereby the length, measured in the direction parallel to the respective edge pair, of the corresponding electrode everywhere exceeds by ? the corresponding length of the area of overlap.

Abstract: A duplexer has an asymmetrical antenna port and a symmetrical reception output, and therefore can be interconnected (without any intermediate stages) to an amplifier with a differential input. A reception bandpass filter is arranged in the reception path of the duplexer. The reception bandpass filter can have the functionality of a balun. The transmission input of the duplexer can be designed symmetrically, in which case a transmission bandpass filter arranged in the transmission path should be designed symmetrically on the input side. The impedance of the antenna port of the duplexer can differ from the impedance of the reception output or the transmission input. No intermediate stages (such as a balun or—in cases of impedances that differ between the duplexer and its corresponding amplifier—an impedance transformer) are required between the duplexer and the amplifier that is interconnected (whether before or after) in the transmission or reception path.

Abstract: A component working with acoustic bulk waves is provided that has a multi-layer substrate, where the multi-layer substrate comprises an integrated matching network and further circuit elements for adapting the electrical filter properties and can serve as carrier substrate for thin-film resonators.