Patents by Inventor Edgar Stone

Edgar Stone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250338387
    Abstract: The described apparatus can include a printed circuit board having a first side that includes an integrated circuit and a second side that is opposite the first side and that includes one or more power delivery components. The apparatus can additionally include a cooling system positioned to cool the one or more power delivery components located on the second side of the printed circuit board. Various other methods and systems are also disclosed.
    Type: Application
    Filed: January 31, 2023
    Publication date: October 30, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Girish Anant Kini, Edgar Stone, Salvador D. Jimenez III, Mark Steinke, Ahmed Mohamed Abou-Alfotouh, Shardul Suresh Adkar
  • Publication number: 20250107045
    Abstract: A method for cooling accelerators having back side power delivery components can include providing a printed circuit board having a first side that includes an integrated circuit and a first set of one or more power delivery components and a second side that is opposite the first side and that includes a second set of one or more power delivery components. The method can also include positioning a first cooling system to cool the integrated circuit and the first set of one or more power delivery components. The method can further include positioning a second cooling system to cool the second set of one or more power delivery components. Various other methods and systems are also disclosed.
    Type: Application
    Filed: September 21, 2023
    Publication date: March 27, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Girish Anant Kini, Shardul Suresh Adkar, Salvador D. Jimenez, III, Mark Steinke, Ethan Cruz, Edgar Stone, Ahmed Mohamed Abou-Alfotouh
  • Publication number: 20250008698
    Abstract: A method for server level cooling can include providing a printed circuit board and attaching a cooling system to the printed circuit board. The cooling system can be configured for placement thereon of two or more expansion cards having back side power delivery components. Various other methods, systems, and computer-readable media are also disclosed.
    Type: Application
    Filed: June 30, 2023
    Publication date: January 2, 2025
    Applicant: Advanced Micro Devices, Inc.
    Inventors: Girish Anant Kini, Ahmed Mohamed Abou-Alfotouh, Shardul Suresh Adkar, Ethan Cruz, Salvador D. Jimenez, III, Mark Steinke, Edgar Stone