Abstract: Aspects of the present disclosure relate to methods of complexing agent content determination. In at least one aspect, a method includes diluting a first solution with water to form a second solution. The first solution includes a nickel source and a complexing agent. The method includes introducing an indicator with the second solution. The method includes titrating the second solution with a base to provide a color change of the second solution. The method includes calculating a content of the complexing agent of the first solution.

Abstract: A method for plating a metallic material onto a titanium substrate, wherein the titanium substrate includes an outer surface and an oxide layer on the outer surface. The method includes chemically etching the outer surface of the titanium substrate to remove at least a portion of the oxide layer, thereby yielding an etched titanium substrate. The method also includes establishing a cathodic protection current through the etched titanium substrate while the etched titanium substrate is immersed in a cathodic electrolyte solution. The method further includes strike plating a bond promoter layer onto the outer surface of the etched titanium substrate after the establishing of the cathodic protection current. The method lastly includes plating the metallic material onto the bond promoter layer.

Abstract: A method for depositing a tin-bismuth alloy on a substrate, the method including steps of (1) immersing the substrate and an anode in an electrolyte solution that includes water, a stannous salt, a bismuth salt, and at least one of sulfuric acid and sulfamic acid, the anode including tin and, optionally, bismuth, and (2) passing an electric current between the substrate and the anode to form a deposit on the substrate.