Abstract: Systems, methods and devices for the remote control of a robot which incorporates interchangeable tool heads. Although applicable to many different industries, the core structure of the system includes a robot with a tool head interface for mechanically, electrically and operatively interconnecting a plurality of interchangeable tool heads to perform various work functions. The robot and tool head may include several levels of digital feedback (local, remote and wide area) depending on the application. The systems include a single umbilical cord to send power, air, and communications signals between the robot and a remote computer. Additionally, all communication (including video) is preferably sent in a digital format. Finally, a GUI running on the remote computer automatically queries and identifies all of the various devices on the network and automatically configures its user options to parallel the installed devices.

Abstract: Systems, methods and devices for the remote control of a robot which incorporates interchangeable tool heads. Although applicable to many different industries, the core structure of the system includes a robot with a tool head interface for mechanically, electrically and operatively interconnecting a plurality of interchangeable tool heads to perform various work functions. The robot and tool head may include several levels of digital feedback (local, remote and wide area) depending on the application. The systems include a single umbilical cord to send power, air, and communications signals between the robot and a remote computer. Additionally, all communication (including video) is preferably sent in a digital format. Finally, a GUI running on the remote computer automatically queries and identifies all of the various devices on the network and automatically configures its user options to parallel the installed devices.

Abstract: Systems, methods and devices for the remote control of a robot which incorporates interchangeable tool heads. Although applicable to many different industries, the core structure of the system includes a robot with a tool head interface for mechanically, electrically and operatively interconnecting a plurality of interchangeable tool heads to perform various work functions. The robot and tool head may include several levels of digital feedback (local, remote and wide area) depending on the application. The systems include a single umbilical cord to send power, air, and communications signals between the robot and a remote computer. Additionally, all communication (including video) is preferably sent in a digital format. Finally, a GUI running on the remote computer automatically queries and identifies all of the various devices on the network and automatically configures its user options to parallel the installed devices.

Abstract: A smart camera system provides focused images to an operator at a host computer by processing digital images at the imaging location prior to sending them to the host computer. The smart camera has a resident digital signal processor for preprocessing digital images prior to transmitting the images to the host. The preprocessing includes image feature extraction and filtering, convolution and deconvolution methods, correction of parallax and perspective image error and image compression. Compression of the digital images in the smart camera at the imaging location permits the transmission of very high resolution color or high resolution grayscale images at real-time frame rates such as 30 frames per second over a high speed serial bus to a host computer or to any other node on the network, including any remote address on the Internet.

Abstract: A smart camera system provides focused images to an operator at a host computer by processing digital images at the imaging location prior to sending them to the host computer. The smart camera has a resident digital signal processor for preprocessing digital images prior to transmitting the images to the host. The preprocessing includes image feature extraction and filtering, convolution and deconvolution methods, correction of parallax and perspective image error and image compression. Compression of the digital images in the smart camera at the imaging location permits the transmission of very high resolution color or high resolution grayscale images at real-time frame rates such as 30 frames per second over a high speed serial bus to a host computer or to any other node on the network, including any remote address on the Internet.

Abstract: A smart camera system provides focused images to an operator at a host computer by processing digital images at the imaging location prior to sending them to the host computer. The smart camera has a resident digital signal processor for preprocessing digital images prior to transmitting the images to the host. The preprocessing includes image feature extraction and filtering, convolution and deconvolution methods, correction of parallax and perspective image error and image compression. Compression of the digital images in the smart camera at the imaging location permits the transmission of very high resolution color or high resolution grayscale images at real-time frame rates such as 30 frames per second over a high speed serial bus to a host computer or to any other node on the network, including any remote address on the Internet.

Abstract: A method and apparatus for component to substrate assembly permits in situ reflow of a flip chip (or other suitable component) in a manner which promotes proper settling of the component as solder begins to flow at the contact points between the component and the substrate. The pick-up head of a placement machine heats the component while applying up to several grams of downward force that serves to level the component. The downward force (downforce) is accurately measured using an electronic force sensor such as a strain gauge, force sensitive resistor, or any other suitable type of force sensor. The initiation of solder reflow can be detected with the pick-up head by sensing a decrease in the downforce.

Abstract: A method and apparatus for component to substrate assembly permits in situ reflow of a flip chip (or other suitable component) in a manner which promotes proper settling of the component as solder begins to flow at the contact points between the component and the substrate. The component is heated and held by a pick-up head while applying downforce that serves to level the component. The initiation of solder reflow can be detected with the pick-up head by sensing a decrease in the downforce. Downforce applied to the component with the pick-up head is then decreased and the retention mechanism holding the component is released, freeing the component from the pick-up head and permitting the component to properly self-center using the liquid solder's surface tension.

Abstract: A semiautomatic method for digital feature separation uses a trained sample selected by an operator using a software “eye dropper” tool or a similar region-of-interest tool to sample features of interest on a stored digital image of, for example, an electronic component such as pads, bumps or leads of the component. Pixels from the sampled features are analyzed and plotted based on their color hue and saturation values or gray scale intensity values. The range of such values is chosen by a user. A second digital image is then compared to the sampled feature data gathered by the “eye dropper” tool. If the color and intensity values of the pixels from the second digital image fall within a user defined acceptable absolute value range, then the locations and values of those pixels in the image are saved.

Abstract: A smart camera system provides focused images to an operator at a host computer by processing digital images at the imaging location prior to sending them to the host computer. The smart camera has a resident digital signal processor for preprocessing digital images prior to transmitting the images to the host. The preprocessing includes image feature extraction and filtering, convolution and deconvolution methods, correction of parallax and perspective image error and image compression. Compression of the digital images in the smart camera at the imaging location permits the transmission of very high resolution color or high resolution grayscale images at real-time frame rates such as 30 frames per second over a high speed serial bus to a host computer or to any other node on the network, including any remote address on the Internet.

Abstract: An electronic imaging system for component to substrate alignment utilizes a single imager and a moveable reflector mounted together in an imager body. The imager body can move into and out of position between a pick-up head of a placement machine, rework machine or similar device, and a target substrate. The imager moves into position for performing alignment tasks. The moveable reflector moves to a first position to image a component held by the pick-up head and a second position to image the substrate. This may be accomplished by mounting the reflector for rotational movement. The imager then moves out of position to permit the pick-up head to perform its placement tasks once alignment is determined. The component can thus be imaged while the pick-up head carries the component from the pick-up position to the place position.

Abstract: A semiautomatic method for digital feature separation uses a trained sample selected by an operator using a software “eye dropper” tool or a similar region-of-interest tool to sample features of interest on a stored digital image of, for example, an electronic component such as pads, bumps or leads of the component. Pixels from the sampled features are analyzed and plotted based on their color hue and saturation values or gray scale intensity values. The range of such values is chosen by a user. A second digital image is then compared to the sampled feature data gathered by the “eye dropper” tool. If the color and intensity values of the pixels from the second digital image fall within a user defined acceptable absolute value range, then the locations and values of those pixels in the image are saved.

Abstract: Distributed machine control software architecture permits modular development of complex machine control systems and allows functional subsystems comprised of object modules to be distributed and remotely controlled and monitored. Software applications are broken into logical subsystems with standardized data and transaction interfaces that act as servers and clients. This permits flexible reconfiguration of machine functions for a variety of applications and promotes system security and reliability by isolating modifications to functional subsystems. In addition, functional modules of the same application do not need to reside in the same host, but can be remotely located over local intranet or via public Internet. In machine control applications this permits real-time and time critical process sequence objects to be resident in the local machine controller while the user interface, database and command generator are at any remote network location, including any Internet addressed location.

Abstract: A machine vision camera observes components to be placed at a selected location on a substrate from a given angle relative to the orthogonal to the substrate through a mirror and then observes the selected location on the substrate from the same angle but with the mirror displaced in order to measure, register and align under-side contact and edge features of the component to corresponding substrate features. The camera moves with the pick-up head of a placement machine that picks up the component from a component feeder or component store and transports it to a location above a mirror where its bottom surface and edges are imaged as it is held stationary. The mirror may be carried with the pick-up head and may be retractable. Component feature coordinate locations are calculated and used to calculate the coordinates of the component features relative to the pick-up head.

Abstract: A method and apparatus for component to substrate assembly permits in situ reflow of a flip chip (or other suitable component) in a manner which promotes proper settling of the component as solder begins to flow at the contact points between the component and the substrate. The pick-up head of a placement machine heats the component while applying up to several grams of downward force that serves to level the component. The downward force (downforce) is accurately measured using an electronic force sensor such as a strain gauge, force sensitive resistor, or any other suitable type of force sensor. The initiation of solder reflow can be detected with the pick-up head by sensing a decrease in the downforce.

Abstract: A hardware architecture links control modules to a host computer in a high-speed serial bus network to achieve efficient distributed machine control. Each control module includes a communications unit and a function unit that are coupled to each other as a part of the control module. All communications units are similarly constructed with each having a unique identification set by a component thereof and provide communications between control modules and the host computer. The function unit of each control module is distinctly configured for executing functions specific to the particular control module to which it is attached. The high-speed serial bus provides deterministic synchronization of data transfers between control modules and the host computer using either an isochronous mode and protocol or an asynchronous mode with a fixed real-time clock issuing data requests at fixed time intervals. Data transfers do not require host computer involvement and can occur directly between control modules.

Abstract: A method for recognizing circular features and determining the true centers of the circular features calculates a fitted circle that has a radius within a small range of the known radius of a known model. This method recognizes circular contact features on electronic components such as bumps on a flip chip and pads on a substrate and other visually similar applications and employs an algorithm which is unaffected by circular feature damage, artifact illuminations or traces connecting pads and contact bumps which create distortions that typically result in inaccuracies in determining the true center of the circular feature when using conventional center of mass or “centroid” algorithms. The method for filtering out the distortions includes determining the distance from the centroid of the circular contact feature to the boundary as a function of angle. Determining the boundary data in this manner creates a signature which provides a one dimensional representation of a two dimensional boundary.

Abstract: The present invention provides for the accurate placement of an object having a surface pattern by relating the perimeter of the object to the surface pattern, such as a circuit pattern of a semiconductor die. This includes illuminating the object at its front and rear faces and viewing the object with a machine vision system. Front-side illumination of the surface pattern enables the machine vision system to obtain an image of the actual position of the circuit pattern or other pattern of interest on the front of the component. Rear illumination provides a silhouette of the perimeter edges of the component enabling the machine vision system to obtain the actual position of the perimeter edges of the component. A corrective offset from a normative feature location, such as the centroid defined by the perimeter edges of the component, is then calculated.

Abstract: An "on-the-fly" component registration system comprises a two-dimensional imaging camera carried by a component placement nozzle platform in turn carried by a positioning gantry. A reflective surface located on or adjacent to a workpiece on which a component is to be placed allows the camera to image by reflection therefrom the component held by the component placement nozzle and an associated machine vision system to determine position correction information (e.g., .DELTA.x, .DELTA.y and .DELTA..theta.) therefrom while the component placement nozzle platform is traveling on the positioning gantry from a component supply station, by the reflective surface, on the way to a component placement target position on the workpiece.

Abstract: A thermode solder blade for soldering small components in industrial soldering equipment comprises a shaped body formed from an electrically-insulating and heat-conducting material having an electrically-conductive heating element formed thereon and spaced away from a solder contacting surface thereof. The electrically-conductive heating element has an electrical resistance greater than about 4 ohms and preferably greater than about 5 ohms.