Patents by Inventor Edith C. Ong

Edith C. Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4454221
    Abstract: A method for enhancing linewidth control during the patterning of a substrate with a resist is disclosed. Resists used in the invention have chemically separated structures characterized by two types of regions of different chemical composition, which different types of regions are interspersed among each other. Because the resists used in the present invention have chemically separated structures, anisotropic wet development of these resists is achievable with an appropriate bicomponent wet developer. Consequently, after exposure, the image formed in a thin, upper layer of the resist is transferred with vertical walls through the thickness of the resist.
    Type: Grant
    Filed: April 8, 1982
    Date of Patent: June 12, 1984
    Assignee: AT&T Bell Laboratories
    Inventors: Cheng-Hsuan Chen, Edith C. Ong, James C. Phillips, King L. Tai
  • Patent number: 4392298
    Abstract: A method for forming electrical interconnections in an integrated circuit which involves forming an insulating layer on the silicon chip on the lower of two conductive layers to be interconnected, opening a window in the insulating layer, filling the window with a metallic plug by a lift-off technique, and then forming an interconnection pattern extending over the layer and contacting the plug.
    Type: Grant
    Filed: July 27, 1981
    Date of Patent: July 12, 1983
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Robert A. Barker, Edith C. Ong