Abstract: An improved child-resistant blister package is provided in which the lidding component includes a tear-resistant nonwoven layer and a barrier layer. The nonwoven layer can be a melt-spun continuous filament nonwoven web or a flash spun plexifilamentary sheet. The lidding component used in peel off-push through blister packages of the invention contains fewer layers and has improved puncture resistance compared to lidding components used in child-resistant packages known in the art. In addition, in peel off-push through and peel-open package designs of the present invention, the lidding peels more cleanly from the blister component compared to packages known in the art which have a tendency to tear during peeling.