Patents by Inventor Editha Liquido

Editha Liquido has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10181718
    Abstract: Provided herein are improved electrical circuit protection devices for protection against electrostatic discharge (ESD), the devices including a first support substrate, a first electrode and a second electrode formed on the first support substrate, wherein the first electrode and the second electrode are formed from a conductive material. The devices further include a first bonding pad disposed on the first and second electrode, the first bonding pad having a first cavity formed therein; a second support substrate disposed on the first bonding pad, the second support substrate having a second cavity formed therein, and a voltage variable material disposed within the first cavity and the second cavity and electrically connected to the first electrode and the second electrode. The devices further include a second bonding pad disposed on the second support substrate, and a third support substrate disposed on the second bonding pad.
    Type: Grant
    Filed: January 14, 2016
    Date of Patent: January 15, 2019
    Assignee: Littelfuse, Inc.
    Inventors: Conrado De Leon, Albert Enriquez, Editha Liquido, Crispin Zulueta
  • Publication number: 20160218502
    Abstract: Provided herein are improved electrical circuit protection devices for protection against electrostatic discharge (ESD), the devices including a first support substrate, a first electrode and a second electrode formed on the first support substrate, wherein the first electrode and the second electrode are formed from a conductive material. The devices further include a first bonding pad disposed on the first and second electrode, the first bonding pad having a first cavity formed therein; a second support substrate disposed on the first bonding pad, the second support substrate having a second cavity formed therein, and a voltage variable material disposed within the first cavity and the second cavity and electrically connected to the first electrode and the second electrode. The devices further include a second bonding pad disposed on the second support substrate, and a third support substrate disposed on the second bonding pad.
    Type: Application
    Filed: January 14, 2016
    Publication date: July 28, 2016
    Applicant: LITTELFUSE, INC.
    Inventors: Conrado De Leon, Albert Enriquez, Editha Liquido, Crispin Zulueta