Patents by Inventor Edmar C. Escober

Edmar C. Escober has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HGA suspension pad barrier for elimination of solder bridging defect
    Patent number: 8213121
    Abstract: A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: July 3, 2012
    Assignee: Hitachi Global Storage Technologies, Netherlands B.V.
    Inventors: Melvin J. A. Dela Pena, Edmar C. Escober, Sandy E. Joson, Teddy T. Tabarangao
  • HGA suspension pad barrier for elimination of solder bridging defect
    Publication number: 20090091860
    Abstract: A method and apparatus for preventing solder bridging. The method includes providing a substrate layer upon which a solder pad is disposed. The method further includes providing a signal conductive layer within the substrate layer. The method also includes forming a solder pad upon the signal conductive layer. The solder pad has a base surface. The method additionally includes forming a barrier portion above the said base surface of the solder pad. The barrier portion is for controlling solder flow during a reflow process.
    Type: Application
    Filed: October 9, 2007
    Publication date: April 9, 2009
    Inventors: Melvin J. Dela Pena, Edmar C. Escober, Sandy E. Joson, Teddy T. Tabarangao