Patents by Inventor Edmilson Besseler

Edmilson Besseler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250081351
    Abstract: In some examples, a corner shield is provided for protecting a surface-mount device (SMD) on a printed circuit board (PCB). An example corner shield comprises a rigid structure configured to conform to a corner area of the SMD, and one or more mounting surfaces configured to mount the rigid structure to one or more soldering pads on the PCB adjacent to the SMD.
    Type: Application
    Filed: August 29, 2024
    Publication date: March 6, 2025
    Inventors: Edmilson Besseler, Shu-Fong Tsau
  • Publication number: 20240074665
    Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.
    Type: Application
    Filed: December 28, 2022
    Publication date: March 7, 2024
    Inventors: Daniel J. Hiemstra, Jeffrey W. Buchholz, Xiaofan Niu, James C. Clements, Wei Lin, Habib S. Karaki, Paul Mansky, Boyi Fu, Yanfeng Chen, Edmilson Besseler