Abstract: A stacked printed circuit board assembly (PCBA) including an interposer board extending between a two circuit boards. The interposer board has a side wall including pads that are electrically tied to vias extending between electronic components of the circuit boards to allow testing of the electronic components and connections to any other electronic system. The test pads increase the number of probing points of the PCBA. Electrical traces electrically interconnect the test pads to the electronic components and may include electrical traces extending laterally through the interposer boards.

Abstract: A stacked printed circuit board (PCB) assembly is provided comprising a first rigid PCB having high complexity components, a dynamic bending flexible PCB, and a PCB interposer electrically interconnected between the rigid and flexible PCBs. The high complexity components may have a pin count exceeding 100 and pitch under 0.4 mm. The dynamic bending flexible PCB is optimized for flexing by using fabrication processes unsuitable for the complexity components. The rigid and flexible PCBs are manufactured separately then integrated using the PCB interposer. This enables the rigid PCB to utilize processes for optimizing density and complexity without constraining the flexible PCB bending requirements. The discrete approach improves fabrication and bend cycle yields compared to conventional rigid-flex solutions. Reliable dynamic flexing is achieved while integrating complex components requiring rigid PCB fabrication.

Abstract: In some examples, a corner shield is provided for protecting a surface-mount device (SMD) on a printed circuit board (PCB). An example corner shield comprises a rigid structure configured to conform to a corner area of the SMD, and one or more mounting surfaces configured to mount the rigid structure to one or more soldering pads on the PCB adjacent to the SMD.

Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.