Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A method for producing a sensor element, wherein at least parts of the sensor element are subjected to at least one plasma treatment process during production. The plasma treatment process may be either a plasma cleaning process and/or a plasma activation process. During the plasma treatment process, a base element and/or a carrier element of the sensor element is subjected to a plasma treatment process before a placement process and/or before a contact-connecting process with electrical connection means. The sensor element is equipped with at least one measurement probe element and/or at least one electronic circuit. This method is used to produce a sensor element, such as a speed sensor element, that may be used in a motor vehicle.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.

Abstract: A method for producing a sensor element, wherein at least parts of the sensor element are subjected to at least one plasma treatment process during production. The plasma treatment process may be either a plasma cleaning process and/or a plasma activation process. During the plasma treatment process, a base element and/or a carrier element of the sensor element is subjected to a plasma treatment process before a placement process and/or before a contact-connecting process with electrical connection means. The sensor element is equipped with at least one measurement probe element and/or at least one electronic circuit. This method is used to produce a sensor element, such as a speed sensor element, that may be used in a motor vehicle.

Abstract: The present invention discloses a sensor and a method of its manufacture. The sensor is used to sense position shifts, motional velocities or rotational speeds of an encoder and comprises a housing which accommodates electric components. The housing is made up of a first housing part of plastics which is at least in part enwrapped by a second injection-molded housing part that is also made of plastics. The first housing part is designed integrally with at least one positioning element molecularly interfaced with the second housing part.