Patents by Inventor Edmund B. Boucher

Edmund B. Boucher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SCALABLE INTERCHANGEABLE MULTIBAND POWER PACKAGE MOUNTING APPARATUS
    Publication number: 20080079143
    Abstract: A miniature multiple die packaging assembly suitable for use in a radio is provided. The assembly includes a heatsink having contact with a chassis of the radio, a circuit board containing a plurality of active devices having leads to a perimeter of the circuit board, and a mating board having an opening. The mating board attaches along a top perimeter of the circuit board to pass the leads of the circuit board for extending a connection of the active devices to a radio board. The plurality of active devices are in contact and coplanar with the heatsink for providing efficient heat dissipation. The circuit board can interchangeably accept single package die or multiple package die having different sizes and layouts.
    Type: Application
    Filed: September 28, 2006
    Publication date: April 3, 2008
    Applicant: MOTOROLA, INC.
    Inventors: Edmund B. Boucher, George C. Anderson, Jose N. Diaz
  • Reversible heat sink packaging assembly for an integrated circuit
    Patent number: 6813154
    Abstract: A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302) is attached to one side of a die (304). The die (304) fits into the opening (104) of the carrier (102) with the heat sink (302) abutting one side (208) of the carrier and the die being wire bonded (402) to the other side (108) of the carrier. The packaging assembly (400) can be oriented either device side up or down.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: November 2, 2004
    Assignee: Motorola, Inc.
    Inventors: Jose Diaz, Harold M. Cook, Edmund B. Boucher
  • Thermal dissipation package for an electrical surface mount component
    Patent number: 6784366
    Abstract: An electronic component (202), such as a power transistor, is formed of a molded plastic package having top (206), bottom (204) and side (208) surfaces and electrical contacts. A lead frame (210) attaches to one of the contacts and wraps about the component (202) so as to provide heat dissipation capability from the bottom and top surfaces of the molded plastic package.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: August 31, 2004
    Assignee: Motorola, Inc.
    Inventors: Edmund B. Boucher, Harold M. Cook, Jose N. Diaz
  • REVERSIBLE HEAT SINK PACKAGING ASSEMBLY FOR AN INTEGRATED CIRCUIT
    Publication number: 20040109292
    Abstract: A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302) is attached to one side of a die (304). The die (304) fits into the opening (104) of the carrier (102) with the heat sink (302) abutting one side (208) of the carrier and the die being wire bonded (402) to the other side (108) of the carrier. The packaging assembly (400) can be oriented either device side up or down.
    Type: Application
    Filed: December 10, 2002
    Publication date: June 10, 2004
    Inventors: Jose Diaz, Harold M. Cook, Edmund B. Boucher
  • Mounting multiple substrate frame and leadless surface mountable assembly using same
    Patent number: 6208526
    Abstract: A multiple substrate mounting frame (104) includes first (132) and second (130) surfaces and a plurality of windows or cavities (106-112). A set of substrates having electrical circuitry (114-120) are attached and electrically connected to the first surface (132) of the mounting frame (104). The second surface (130) can then be electrically interconnected to a mother board (102). A leadless surface mountable assembly for multiple die (100) includes the mounting frame (104) which receives a plurality of substrates (114-120) and electrically interconnects them to each other and/or to a mother board (102). A heat sink (122) can be provided if the die (134, 124) generate too much heat.
    Type: Grant
    Filed: July 23, 1999
    Date of Patent: March 27, 2001
    Assignee: Motorola, Inc.
    Inventors: Curtis M. Griffin, Jeffrey A. Rollman, Edmund B. Boucher