Abstract: A system includes a central server; a reader in communication with the central server; and a set of equipment racks. Each equipment rack of the set of equipment racks defines a face. The each equipment rack includes an observer device and at least two antenna arrays. At least one of the at least two antennas is in communication with the observer device. The system further including a set of tags attached to assets disposed within the set of equipment racks. Each tag of the set of tags is to transmit a beacon signal including a tag identifier of the each tag. The at least one antenna is to receive the beacon signal. The observer device is to communicate the tag identifier and the characteristics of the beacon signal to the reader and central server. The central server determines a rack location based on the characteristics of the beacon signal.

Abstract: A system includes a central server; a reader in communication with the central server; and a set of equipment racks. Each equipment rack of the set of equipment racks defines a face. The each equipment rack includes an observer device and at least two antenna arrays. At least one of the at least two antennas is in communication with the observer device. The system further including a set of tags attached to assets disposed within the set of equipment racks. Each tag of the set of tags is to transmit a beacon signal including a tag identifier of the each tag. The at least one antenna is to receive the beacon signal. The observer device is to communicate the tag identifier and the characteristics of the beacon signal to the reader and central server. The central server determines a rack location based on the characteristics of the beacon signal.

Abstract: A system includes a central server; a reader in communication with the central server; and a set of equipment racks. Each equipment rack of the set of equipment racks defines a face. The each equipment rack includes an observer device and at least two antenna arrays. At least one of the at least two antennas is in communication with the observer device. The system further including a set of tags attached to assets disposed within the set of equipment racks. Each tag of the set of tags is to transmit a beacon signal including a tag identifier of the each tag. The at least one antenna is to receive the beacon signal. The observer device is to communicate the tag identifier and the characteristics of the beacon signal to the reader and central server. The central server determines a rack location based on the characteristics of the beacon signal.

Abstract: A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.

Abstract: A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.

Abstract: A semiconductor package includes a package substrate and an integrated circuit. The package substrate has a first surface. The integrated circuit couples electrically to the first surface of the package substrate. The integrated circuit and the package substrate together form the semiconductor package. The semiconductor package also includes a first inductance circuit and a second inductance circuit, both formed within the semiconductor package. The first and second inductance circuits couple to each other in parallel. The first and second inductance circuits have substantially symmetrical geometric characteristics.

Abstract: A method and apparatus for synthesizing high-frequency signals is disclosed that overcomes integration problem associated with prior implementations while meeting demanding phase noise and other impurity requirements. In one embodiment, on-package oscillator circuit inductors are provided for band selection purposes, with no external package connection to connect off-package or external inductors to on-package inductance circuits. Multiple package electrical connection points may also be provided on-package to allow for selection of alternate oscillator inductance values during package assembly.

Abstract: A method and apparatus for synthesizing high-frequency signals that overcomes integration problems while meeting demanding phase noise and other impurity requirements. In one embodiment, on-package oscillator circuit inductors are provided for band selection purposes, with no external package connection to connect off-package or external inductors to on-package inductance circuits. Multiple package electrical connection points may also be provided on-package to allow for selection of alternate oscillator inductance values during package assembly.