Patents by Inventor Edmund Juris Sprogis
Edmund Juris Sprogis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080274583Abstract: A through-wafer via structure and method for forming the same. The through-wafer via structure includes a wafer having an opening and a top wafer surface. The top wafer surface defines a first reference direction perpendicular to the top wafer surface. The through-wafer via structure further includes a through-wafer via in the opening. The through-wafer via has a shape of a rectangular plate. A height of the through-wafer via in the first reference direction essentially equals a thickness of the wafer in the first reference direction. A length of the through-wafer via in a second reference direction is at least ten times greater than a width of the through-wafer via in a third reference direction. The first, second, and third reference directions are perpendicular to each other.Type: ApplicationFiled: March 23, 2007Publication date: November 6, 2008Inventors: Paul Stephen Andry, Edmund Juris Sprogis, Kenneth Jay Stein, Timothy Dooling Sullivan, Cornelia Kang-I Tsang, Ping-Chuan Wang, Bucknell C. Webb
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Publication number: 20080261121Abstract: A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and opposite top and bottom surfaces, the first opaque regions including a metal; the non-printable region including metal second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and opposite top and bottom surface, the second opaque regions including the metal; and a conformal protective metal oxide capping layer on top surfaces and sidewalls of the first and second opaque regions. The conformal layer is formed by oxidation.Type: ApplicationFiled: April 20, 2007Publication date: October 23, 2008Inventors: Jeffrey Peter Gambino, Robert Kenneth Leidy, Kirk David Peterson, Jed Hickory Rankin, Edmund Juris Sprogis
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Publication number: 20080261120Abstract: A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and opposite top and bottom surfaces, the first opaque regions including a metal; the non-printable region including metal second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and opposite top and bottom surface, the second opaque regions including the metal; and a conformal protective metal oxide capping layer on top surfaces and sidewalls of the first and second opaque regions. The conformal layer is formed by oxidation.Type: ApplicationFiled: April 20, 2007Publication date: October 23, 2008Inventors: Jeffrey Peter Gambino, Robert Kenneth Leidy, Kirk David Peterson, Jed Hickory Rankin, Edmund Juris Sprogis
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Publication number: 20080261122Abstract: A photomask and a method of fabricating the photomask. The photomask including: a substrate transparent to a selected wavelength or wavelengths of radiation, the substrate having a top surface and an opposite bottom surface, the substrate having a printable region and a non-printable region; the printable region having first opaque regions raised above the top surface of the substrate adjacent to clear regions, each opaque region of the first opaque regions having sidewalls and a top surface; the non-printable region comprising a second opaque region raised above the top surface of the substrate, the second opaque region having sidewalls and a top surface; and a capping layer on the sidewalls of the first opaque regions and the sidewalls of the second opaque region.Type: ApplicationFiled: April 20, 2007Publication date: October 23, 2008Inventors: Jeffrey Peter Gambino, Robert Kenneth Leidy, Kirk David Peterson, Jed Hickory Rankin, Edmund Juris Sprogis
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Patent number: 7348210Abstract: A structure and a method for forming the same. The method includes (a) providing a structure which includes (i) a dielectric layer, (ii) an electrically conducting bond pad on and in direct physical contact with the dielectric layer top surface, (iii) a first passivation layer on the dielectric layer top surface and on the electrically conducting bond pad, wherein the first passivation layer comprises a first hole directly above the electrically conducting bond pad, and (iv) an electrically conducting solder bump filling the first hole and electrically coupled to the electrically conducting bond pad; and (b) forming a second passivation layer on the first passivation layer, wherein second passivation layer is in direct physical contact with the electrically conducting solder bump, and wherein the electrically conducting solder bump is exposed to a surrounding ambient immediately after said forming the second passivation layer is performed.Type: GrantFiled: April 27, 2005Date of Patent: March 25, 2008Assignee: International Business Machines CorporationInventors: Timothy H. Daubenspeck, Jeffrey Peter Gambino, Christopher David Muzzy, Wolfgang Sauter, Edmund Juris Sprogis
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Patent number: 7276787Abstract: A carrier structure and method for fabricating a carrier structure with through-vias each having a conductive structure with an effective coefficient of thermal expansion which is less than or closely matched to that of the substrate, and having an effective elastic modulus value which is less than or closely matches that of the substrate. The conductive structure may include concentric via fill areas having differing materials disposed concentrically therein, a core of the substrate material surrounded by an annular ring of conductive material, a core of CTE-matched non-conductive material surrounded by an annular ring of conductive material, a conductive via having an inner void with low CTE, or a full fill of a conductive composite material such as a metal-ceramic paste which has been sintered or fused.Type: GrantFiled: December 5, 2003Date of Patent: October 2, 2007Assignee: International Business Machines CorporationInventors: Daniel Charles Edelstein, Paul Stephen Andry, Leena Paivikki Buchwalter, Jon Alfred Casey, Sherif A. Goma, Raymond R. Horton, Gareth Geoffrey Hougham, Michael Wayne Lane, Xiao Hu Liu, Chirag Suryakant Patel, Edmund Juris Sprogis, Michelle Leigh Steen, Brian Richard Sundlof, Cornelia K. Tsang, George Frederick Walker
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Patent number: 7193423Abstract: Structures for aligning wafers and methods for operating the same. The structure includes (a) a first semiconductor wafer including a first capacitive coupling structure, and (b) a second semiconductor wafer including a second capacitive coupling structure. The first and second semiconductor wafers are in direct physical contact with each other via a common surface. If the first and second semiconductor wafers are moved with respect to each other by a first displacement distance of 1 nm in a first direction while the first and second semiconductor wafers are in direct physical contact with each other via the common surface, then a change of at least 10?18 F in capacitance of a first capacitor comprising the first and second capacitive coupling structures results. The first direction is essentially parallel to the common surface.Type: GrantFiled: December 12, 2005Date of Patent: March 20, 2007Assignee: International Business Machines CorporationInventors: Timothy Joseph Dalton, Jeffrey Peter Gambino, Mark David Jaffe, Stephen Ellinwood Luce, Edmund Juris Sprogis
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Patent number: 6642080Abstract: Chip-on-chip interconnections of varied characteristics, such as varied diameters, heights and/or composition, are disclosed. A first chip-on-chip interconnection on a joining plane has a first characteristic (e.g., a first height) and a second chip-on-chip interconnection on the same joining plane has a second characteristic (e.g., a second height greater than the first height). The first and second characteristics of the chip-on-chip interconnections allow for chip-on-chip connections to other packages, substrates or chips of different levels and/or compositions.Type: GrantFiled: October 18, 2000Date of Patent: November 4, 2003Assignee: International Business Machines CorporationInventors: Thomas George Ference, Wayne John Howell, Edmund Juris Sprogis
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Patent number: 6507115Abstract: A multi-chip module is disclosed in which a first die connects to a second set of die via a set of C4 connections within a single package. Low resistivity signal posts are provided within the lateral separation between adjacent die in the second set of die. These signal posts are connectable to externally supplied power signals. The power signals provided to the signals posts are routed to circuits within the second set of die over relatively short metallization interconnects. The signal posts may be connected to thermally conductive via elements and the package may include heat spreaders on upper and lower package surfaces. The first die may comprise a DRAM while the second set of die comprise portions of a general purpose microprocessor. The power signals provided to the second set of die may be connected to a capacitor terminal in the first die to provide power signal decoupling.Type: GrantFiled: December 14, 2000Date of Patent: January 14, 2003Assignee: International Business Machines CorporationInventors: Harm Peter Hofstee, Robert Kevin Montoye, Edmund Juris Sprogis
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Publication number: 20020074668Abstract: A multi-chip module is disclosed in which a first die connects to a second set of die via a set of C4 connections within a single package. Low resistivity signal posts are provided within the lateral separation between adjacent die in the second set of die. These signal posts are connectable to externally supplied power signals. The power signals provided to the signals posts are routed to circuits within the second set of die over relatively short metallization interconnects. The signal posts may be connected to thermally conductive via elements and the package may include heat spreaders on upper and lower package surfaces. The first die may comprise a DRAM while the second set of die comprise portions of a general purpose microprocessor. The power signals provided to the second set of die may be connected to a capacitor terminal in the first die to provide power signal decoupling.Type: ApplicationFiled: December 14, 2000Publication date: June 20, 2002Applicant: International Business Machines CorporationInventors: Harm Peter Hofstee, Robert Kevin Montoye, Edmund Juris Sprogis
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Patent number: 6294406Abstract: The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.Type: GrantFiled: July 6, 1999Date of Patent: September 25, 2001Assignee: International Business Machines CorporationInventors: Claude Louis Bertin, Thomas George Ference, Wayne John Howell, Edmund Juris Sprogis
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Patent number: 6225699Abstract: Chip-on-chip interconnections of varied characteristics, such as varied diameters, heights and/or composition, are disclosed. A first chip-on-chip interconnection on a joining plane has a first characteristic (e.g., a first height) and a second chip-on-chip interconnection on the same joining plane has a second characteristic (e.g., a second height greater than the first height). The first and second characteristics of the chip-on-chip interconnections allow for chip-on-chip connections to other packages, substrates or chips of different levels and/or compositions.Type: GrantFiled: June 26, 1998Date of Patent: May 1, 2001Assignee: International Business Machines CorporationInventors: Thomas George Ference, Wayne John Howell, Edmund Juris Sprogis
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Patent number: 5977640Abstract: The advantages of the invention are realized by a chip-on-chip module having at least two fully functional chips, electrically connected together, and a chip-on-chip component connection/interconnection for electrically connecting the fully functional chips to external circuitry.Type: GrantFiled: June 26, 1998Date of Patent: November 2, 1999Assignee: International Business Machines CorporationInventors: Claude Louis Bertin, Thomas George Ference, Wayne John Howell, Edmund Juris Sprogis
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Patent number: 5935763Abstract: An opening in an insulator on a substrate is self-aligned to a reflective region on the substrate. The opening is formed by shining blanket radiation on photoresist on the insulator and developing to open the resist and insulator. The resist region that is above the reflective region absorbs both incident and reflected radiation, a larger total dose of radiation than is absorbed by resist above non-reflective regions. The incident dose is adjusted to provide a below threshold dose everywhere except to those regions of resist that are above highly reflective regions.Type: GrantFiled: June 11, 1996Date of Patent: August 10, 1999Assignee: International Business Machines CorporationInventors: Michael Dean Caterer, Timothy Harrison Daubenspeck, Thomas George Ference, Edmund Juris Sprogis
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Patent number: 5923181Abstract: Methods and apparatus are set forth for burn-in stressing and simultaneous testing of a plurality of semiconductor device chips laminated together in a stack configuration to define a multichip module. Testing is facilitated by connecting temporary interconnect wiring to an access surface of the multichip module. This temporary interconnect wiring electrically interconnects at least some semiconductor device chips within the module. Prior to burn-in stressing and testing, a separate electrical screening step occurs to identify any electrical defect in the connection between the temporary interconnect wiring and the multichip module. If an electrical defect is identified, various techniques for removing or isolating the defect are presented. Thereafter, burn-in stressing and simultaneous testing of the semiconductor chips within the multichip module occurs using the temporary interconnect wiring.Type: GrantFiled: April 24, 1997Date of Patent: July 13, 1999Assignee: International Business Machine CorporationInventors: Kenneth Edward Beilstein, Jr., Claude Louis Bertin, Dennis Charles Dubois, Wayne John Howell, Gordon Arthur Kelley, Jr., Christopher Paul Miller, David Jacob Perlman, Gustav Schrottke, Edmund Juris Sprogis, Jody John VanHorn
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Patent number: 5686843Abstract: Methods and apparatus are set forth for burn-in stressing and simultaneous testing of a plurality of semiconductor device chips laminated together in a stack configuration to define a multichip module. Testing is facilitated by connecting temporary interconnect wiring to an access surface of the multichip module. This temporary interconnect wiring electrically interconnects at least some semiconductor device chips within the module. Prior to burn-in stressing and testing, a separate electrical screening step occurs to identify any electrical defect in the connection between the temporary interconnect wiring and the multichip module. If an electrical defect is identified, various techniques for removing or isolating the defect are presented. Thereafter, burn-in stressing and simultaneous testing of the semiconductor chips within the multichip module occurs using the temporary interconnect wiring.Type: GrantFiled: June 30, 1995Date of Patent: November 11, 1997Assignee: International Business Machines CorporationInventors: Kenneth Edward Beilstein, Jr., Claude Louis Bertin, Dennis Charles Dubois, Wayne John Howell, Gordon Arthur Kelley, Jr., Christopher Paul Miller, David Jacob Perlman, Gustav Schrottke, Edmund Juris Sprogis, Jody John VanHorn