Patents by Inventor Edmund Low Kwok Chung

Edmund Low Kwok Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MICROELECTRONIC COMPONENT ASSEMBLIES WITH RECESSED WIRE BONDS AND METHODS OF MAKING SAME
    Publication number: 20080164591
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a substrate, and at least one bond wire. The substrate has a reduced-thickness base adjacent terminals of the microelectronic component and a body having a contact surface spaced farther from the microelectronic component than a bond pad surface of the base. The bond wire couples the microelectronic component to a bond pad carried by the bond pad surface and has a maximum height outwardly from the microelectronic component that is no greater than the height of the contact surface from the microelectronic component.
    Type: Application
    Filed: March 12, 2008
    Publication date: July 10, 2008
    Applicant: Micron Technology, Inc.
    Inventors: Eric Tan Swee Seng, Edmund Low Kwok Chung
  • Microelectronic component assemblies with recessed wire bonds and methods of making same
    Patent number: 7365424
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a substrate, and at least one bond wire. The substrate has a reduced-thickness base adjacent terminals of the microelectronic component and a body having a contact surface spaced farther from the microelectronic component than a bond pad surface of the base. The bond wire couples the microelectronic component to a bond pad carried by the bond pad surface and has a maximum height outwardly from the microelectronic component that is no greater than the height of the contact surface from the microelectronic component.
    Type: Grant
    Filed: May 18, 2006
    Date of Patent: April 29, 2008
    Assignee: Micron Technology, Inc.
    Inventors: Eric Tan Swee Seng, Edmund Low Kwok Chung
  • Microelectronic component assemblies with recessed wire bonds and methods of making same
    Patent number: 7250328
    Abstract: The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, a substrate, and at least one bond wire. The substrate has a reduced-thickness base adjacent terminals of the microelectronic component and a body having a contact surface spaced farther from the microelectronic component than a bond pad surface of the base. The bond wire couples the microelectronic component to a bond pad carried by the bond pad surface and has a maximum height outwardly from the microelectronic component that is no greater than the height of the contact surface from the microelectronic component.
    Type: Grant
    Filed: August 30, 2004
    Date of Patent: July 31, 2007
    Assignee: Micron Technology, Inc.
    Inventors: Erin Tan Swee Seng, Edmund Low Kwok Chung