Abstract: Disclosed is an interposer assembly that can be located between an integrated circuit package and a circuit carrying element for establishing communication there between. The interposer assembly includes a frame defining a window that holds together a plurality of panels having apertures for accommodating electrical contacts. Each panel includes an interlocking edge for engaging an opposing interlocking edge of an adjacent panel and a frame edge for engaging the frame. The apertures can be arranged across the panels to extend from the frame edge to a location near the interlocking edges. In various embodiments, the interlocking edges can be formed as a tongue and groove design or as a pair of interlocking claws. In an embodiment, the frame edge can include a flange that is set within a step formed on the frame. The panel and frame may be permanently joined by heat staking.