Abstract: A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a portion of an outer periphery of the one or more semiconductor devices and an inner periphery of the interposer to facilitation securing of the one or more semiconductor devices in place relative to the interposer. The retention element may be removed from the semiconductor devices. Once the one or more semiconductor devices are in place, they may be electrically connected to the interposer.

Abstract: Methods and structures for die packages are described. The die package includes an integrated circuit die connected to and elevated above a substrate. In an embodiment, wire bonds connects pads on the die to pads on the substrate. The substrate pads are closely adjacent the die due to the die support being positioned inwardly of the peripheral surface of the die. In an embodiment, the die support includes a paste that flows outwardly when connecting the die to the substrate. The outward paste flow extends from beneath the die support but does not extend outwardly of the die so as to not interfere or contact the substrate pads.