Patents by Inventor Edmund W. CHEN

Edmund W. CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11563458
    Abstract: Systems and methods for RF hazard protection are provided. In one embodiment, a RF protection coupler comprises: a first port to couple to an output of an RF source circuit; a second port to couple to an external RF load; a source side and load side RF switches, wherein the source side RF switch and the load side RF switch are each switch between a first and second states in response to a detected matting. In the first state the source and load side RF switches establish an electrical path between the first and second ports. In the second state: the source side RF switch couples the first port to an impedance load that is impedance matched to the output of the RF source circuit; the load side RF switch couples the second port to an electrical ground; and a gap between the switches electrically isolates the ports.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: January 24, 2023
    Assignee: CommScope Technologies LLC
    Inventors: Karl-Heinz Fackler, Rainer Friedrich, Anand Krishnamachari, Edmund W Chen
  • Publication number: 20210226659
    Abstract: Systems and methods for RF hazard protection are provided. In one embodiment, a RF protection coupler comprises: a first port to couple to an output of an RF source circuit; a second port to couple to an external RF load; a source side and load side RF switches, wherein the source side RF switch and the load side RF switch are each switch between a first and second states in response to a detected matting. In the first state the source and load side RF switches establish an electrical path between the first and second ports. In the second state: the source side RF switch couples the first port to an impedance load that is impedance matched to the output of the RF source circuit; the load side RF switch couples the second port to an electrical ground; and a gap between the switches electrically isolates the ports.
    Type: Application
    Filed: December 3, 2020
    Publication date: July 22, 2021
    Applicant: CommScope Technologies LLC
    Inventors: Karl-Heinz Fackler, Rainer Friedrich, Anand Krishnamachari, Edmund W. Chen
  • Patent number: 10283947
    Abstract: A reduced or low-profile mechanical clip is described. This mechanical clip may include a trench that constrains the mechanical degrees of freedom of wires, such as those between an interface circuit and an antenna in an electronic device. Moreover, the mechanical clip may have a low height (such as less than 3 mm) so it can fit in a confined space between components in the interior of the electronic device. The mechanical clip may be mountable on a surface in the interior of the electronic device, such as on a printed circuit board or on an inner surface of a chassis or external housing of the electronic device.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: May 7, 2019
    Assignee: ARRIS Enterprises LLC
    Inventors: Edmund W. Chen, Gilbert W. VanHoy
  • Publication number: 20170353021
    Abstract: A reduced or low-profile mechanical clip is described. This mechanical clip may include a trench that constrains the mechanical degrees of freedom of wires, such as those between an interface circuit and an antenna in an electronic device. Moreover, the mechanical clip may have a low height (such as less than 3 mm) so it can fit in a confined space between components in the interior of the electronic device. The mechanical clip may be mountable on a surface in the interior of the electronic device, such as on a printed circuit board or on an inner surface of a chassis or external housing of the electronic device. By mechanically constraining the mechanical degrees of freedom of the wires, the mechanical clip may reduce electrical noise induced by motion of the wires. In addition, the mechanical clip may facilitate low-cost reproducible assembly of the electronic device.
    Type: Application
    Filed: December 11, 2014
    Publication date: December 7, 2017
    Applicant: Ruckus Wireless, Inc.
    Inventors: Edmund W. CHEN, Gilbert W. VANHOY