Patents by Inventor Edo Maria Hulsebos
Edo Maria Hulsebos has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10527958Abstract: A method for determining one or more optimized values of an operational parameter of a sensor system configured to measure a property of a substrate is disclosed. The method includes: determining a quality parameter for a plurality of substrates; determining measurement parameter values for the plurality of substrates using the sensor system for a plurality of values of the operational parameter; comparing a substrate to substrate variation of the quality parameter and a substrate to substrate variation of a mapping of the measurement parameter values; and determining the one or more optimized values of the operational parameter based on the comparing.Type: GrantFiled: September 17, 2018Date of Patent: January 7, 2020Assignee: ASML Netherlands B.V.Inventors: Patricius Aloysius Jacobus Tinnemans, Edo Maria Hulsebos, Henricus Johannes Lambertus Megens, Sudharshanan Raghunathan, Boris Menchtchikov, Ahmet Koray Erdamar, Loek Johannes Petrus Verhees, Willem Seine Christian Roelofs, Wendy Johanna Martina Van De Ven, Hadi Yagubizade, Hakki Ergün Cekli, Ralph Brinkhof, Tran Thanh Thuy Vu, Maikel Robert Goosen, Maaike Van't Westeinde, Weitian Kou, Manouk Rijpstra, Matthijs Cox, Franciscus Godefridus Casper Bijnen
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Patent number: 10514620Abstract: A method of determining the position of an alignment mark on a substrate, the alignment mark having first and second segment, the method including illuminating the alignment mark with radiation, detecting radiation diffracted by the alignment mark and generating a resulting alignment signal. The alignment signal has a first component received during illumination of the first segment only, a second component received during illumination of the second segment only, and a third component received during simultaneous illumination of both segments. The positions of the segments are determined using the first component, the second component and the third component of the alignment signal.Type: GrantFiled: August 14, 2017Date of Patent: December 24, 2019Assignees: ASML Holding N.V., ASML Netherlands B.V.Inventors: Franciscus Godefridus Casper Bijnen, Simon Gijsbert Josephus Mathijssen, Vassili Demergis, Edo Maria Hulsebos
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Patent number: 10474045Abstract: A method of characterizing a deformation of a plurality of substrates is described. The method includes: measuring, for a plurality of n different alignment measurement parameters ? and for a plurality of substrates, a position of the alignment marks; determining a positional deviation as the difference between the n alignment mark position measurements and a nominal alignment mark position; grouping the positional deviations into data sets; determining an average data set; subtracting the average data set from the data sets to obtain a plurality of variable data sets; performing a blind source separation method on the variable data sets, thereby decomposing the variable data sets into a set of eigenwafers representing principal components of the variable data sets; and subdividing the set of eigenwafers into a set of mark deformation eigenwafers and a set of substrate deformation eigenwafers.Type: GrantFiled: June 28, 2016Date of Patent: November 12, 2019Assignee: ASML Netherlands B.V.Inventors: Franciscus Godefridus Casper Bijnen, Arie Jeffrey Den Boef, Richard Johannes Franciscus Van Haren, Patricius Aloysius Jacobus Tinnemans, Alexander Ypma, Irina Anatolievna Lyulina, Edo Maria Hulsebos, Hakki Ergün Cekli, Xing Lan Liu, Loek Johannes Petrus Verhees, Victor Emanuel Calado, Leon Paul Van Dijk
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Publication number: 20190265598Abstract: In a method of controlling a lithographic apparatus, historical performance measurements are used to calculate a process model relating to a lithographic process. Current positions of a plurality of alignment marks provided on a current substrate are measured and used to calculate a substrate model relating to a current substrate. Additionally, historical position measurements obtained at the time of processing the prior substrates are used with the historical performance measurements to calculate a model mapping. The model mapping is applied to modify the substrate model. The lithographic apparatus is controlled using the process model and the modified substrate model together. Overlay performance is improved by avoiding over- or under-correction of correlated components of the process model and the substrate model. The model mapping may be a subspace mapping, and dimensionality of the model mapping may be reduced, before it is used.Type: ApplicationFiled: May 10, 2019Publication date: August 29, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Edo Maria HULSEBOS, Patricius Aloysius Jacobus TINNEMANS, Ralp BRINKHOF, Pieter Jacob HERES, Jorn Kjeld LUCAS, Loek Johannes Petrus VERHEES, Ingrid Margaretha Ardina VAN DONKELAAR, Franciscus Godefridus Casper BIJNEN
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Publication number: 20190235391Abstract: A measurement apparatus and method for determining a substrate grid describing a deformation of a substrate prior to exposure of the substrate in a lithographic apparatus configured to fabricate one or more features on the substrate. Position data for a plurality of first features and/or a plurality of second features on the substrate is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. The substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus for controlling at least part of an exposure process to fabricate one or more features on the substrate.Type: ApplicationFiled: December 21, 2018Publication date: August 1, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Franciscus Godefridus Casper BIJNEN, Edo Maria Hulsebos, Henricus Johannes Lambertus Megens, Robert John Socha, Youping Zhang
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Publication number: 20190227446Abstract: A method of determining the position of an alignment mark on a substrate, the alignment mark having first and second segment, the method including illuminating the alignment mark with radiation, detecting radiation diffracted by the alignment mark and generating a resulting alignment signal. The alignment signal has a first component received during illumination of the first segment only, a second component received during illumination of the second segment only, and a third component received during simultaneous illumination of both segments. The positions of the segments are determined using the first component, the second component and the third component of the alignment signal.Type: ApplicationFiled: August 14, 2017Publication date: July 25, 2019Applicants: ASML NETHERLANDS B.V., ASML HOLDING N.V.Inventors: Franciscus Godefridus Casper BIJNEN, Simon Gijsbert Josephus MATHIJSSEN, Vassili DEMERGIS, Edo Maria HULSEBOS
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Patent number: 10331040Abstract: In a method of controlling a lithographic apparatus, historical performance measurements are used to calculate a process model relating to a lithographic process. Current positions of a plurality of alignment marks provided on a current substrate are measured and used to calculate a substrate model relating to a current substrate. Additionally, historical position measurements obtained at the time of processing the prior substrates are used with the historical performance measurements to calculate a model mapping. The model mapping is applied to modify the substrate model. The lithographic apparatus is controlled using the process model and the modified substrate model together. Overlay performance is improved by avoiding over- or under-correction of correlated components of the process model and the substrate model. The model mapping may be a subspace mapping, and dimensionality of the model mapping may be reduced, before it is used.Type: GrantFiled: September 15, 2016Date of Patent: June 25, 2019Assignee: ASML Netherlands B.V.Inventors: Edo Maria Hulsebos, Patricius Aloysius Jacobus Tinnemans, Ralph Brinkhof, Pieter Jacob Heres, Jorn Kjeld Lucas, Loek Johannes Petrus Verhees, Ingrid Margaretha Ardina Van Donkelaar, Franciscus Godefridus Casper Bijnen
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Publication number: 20190094721Abstract: A method for determining one or more optimized values of an operational parameter of a sensor system configured to measure a property of a substrate is disclosed. The method includes: determining a quality parameter for a plurality of substrates; determining measurement parameter values for the plurality of substrates using the sensor system for a plurality of values of the operational parameter; comparing a substrate to substrate variation of the quality parameter and a substrate to substrate variation of a mapping of the measurement parameter values; and determining the one or more optimized values of the operational parameter based on the comparing.Type: ApplicationFiled: September 17, 2018Publication date: March 28, 2019Applicant: ASML NETHERLANDS B.V.Inventors: Patricius Aloysius Jacobus TINNEMANS, Edo Maria HULSEBOS, Henricus Johannes Lambertus MEGENS, Sudharshanan RAGHUNATHAN, Boris MENCHTCHIKOV, Ahmet Koray ERDAMAR, Loek Johannes Petrus VERHEES, Willem Seine Christian ROELOFS, Wendy Johanna Martina VAN DE VEN, Hadi YAGUBIZADE, Hakki Ergün CEKLI, Ralph BRINKHOF, Tran Thanh Thuy VU, Maikel Robert GOOSEN, Maaike VAN'T WESTEINDE, Weitian KOU, Manouk RIJPSTRA, Matthijs COX, Franciscus Godefridus Casper BIJNEN
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Publication number: 20180356742Abstract: A lithographic apparatus has a substrate table on which a substrate is positioned, and an alignment sensor used to measure the alignment of the substrate. In an exemplary processing method, the alignment sensor is used to perform one or more edge measurements in a first step. In a second step, one or more edge measurements are performed on the notch of the substrate. The edge measurements are then used to align the substrate in the lithographic apparatus. In a particular example, the substrate is arranged relative to the alignment sensor such that a portion of the edge surface is positioned at the focal length of the lens. When the alignment sensor detects radiation scattered by the edge surface at the focal length of the lens, the presence of the edge of the substrate is detected.Type: ApplicationFiled: October 27, 2016Publication date: December 13, 2018Inventors: Cayetano SANCHEZ-FABRES COBALEDA, Franciscus Godefridus Casper BIJNEN, Edo Maria HULSEBOS, Arie Jeffrey DEN BOEF, Marcel Hendrikus Maria BEEMS, Piotr Michal STOLARZ
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Patent number: 10139740Abstract: A lithographic apparatus is described, the apparatus comprising: an illumination system configured to condition a radiation beam; a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto a target portion of the substrate, wherein the apparatus further comprises an alignment system configured to perform, for one or more alignment marks that are present on the substrate: —a plurality of alignment mark position measurements for the alignment mark by applying a respective plurality of different alignment measurement parameters, thereby obtaining a plurality of measured alignment mark positions for the alignment mark; the apparatus further comprising a processing unit, the processing unit being configured to: —determine, for each of the plurality of aType: GrantFiled: July 7, 2016Date of Patent: November 27, 2018Assignee: ASML NETHERLANDS B.V.Inventors: Franciscus Godefridus Casper Bijnen, Edo Maria Hulsebos
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Publication number: 20180284621Abstract: In a method of controlling a lithographic apparatus, historical performance measurements are used to calculate a process model relating to a lithographic process. Current positions of a plurality of alignment marks provided on a current substrate are measured and used to calculate a substrate model relating to a current substrate. Additionally, historical position measurements obtained at the time of processing the prior substrates are used with the historical performance measurements to calculate a model mapping. The model mapping is applied to modify the substrate model. The lithographic apparatus is controlled using the process model and the modified substrate model together. Overlay performance is improved by avoiding over- or under-correction of correlated components of the process model and the substrate model. The model mapping may be a subspace mapping, and dimensionality of the model mapping may be reduced, before it is used.Type: ApplicationFiled: September 15, 2016Publication date: October 4, 2018Applicant: ASML NETHERLANDS B.V.Inventors: Edo Maria HULSEBOS, Patricius Aloysius Jacobus TINNEEMANS, Ralph BRINKHOF, Pieter Jacob HERES, Jorn Kjeld LUCAS, Lock Johannes Petrus VERHEES, Ingrid Margaretha Ardina VAN DONKELAAR, Francicus Godefridus Casper BIJNEN
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Publication number: 20180196363Abstract: A lithographic apparatus is described, the apparatus comprising: an illumination system configured to condition a radiation beam; a support constructed to support a patterning device, the patterning device being capable of imparting the radiation beam with a pattern in its cross-section to form a patterned radiation beam; a substrate table constructed to hold a substrate; and a projection system configured to project the patterned radiation beam onto a target portion of the substrate, wherein the apparatus further comprises an alignment system configured to perform, for one or more alignment marks that are present on the substrate: —a plurality of alignment mark position measurements for the alignment mark by applying a respective plurality of different alignment measurement parameters, thereby obtaining a plurality of measured alignment mark positions for the alignment mark; the apparatus further comprising a processing unit, the processing unit being configured to: —determine, for each of the plurality of aType: ApplicationFiled: July 7, 2016Publication date: July 12, 2018Applicant: ASML NETHERLANDS B.V.Inventors: Franciscus Godefridus Casper BIJNEN, Edo Maria HULSEBOS
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Patent number: 9665012Abstract: A method involving obtaining first calibration vibration data relating to vibrations of the lithographic apparatus from a sensor that is part of the lithographic apparatus and obtaining second calibration vibration data, the second calibration vibration data being a component of first parameter data of the lithographic apparatus. A filter is calculated from the first and second calibration vibration data, the filter being such that when applied to the first calibration vibration data, its output correlates closer with the second calibration vibration data. The filter can then be applied to vibration data obtained using the first sensor to obtain an estimate of a vibration component of the first parameter data during the lithographic process.Type: GrantFiled: October 8, 2013Date of Patent: May 30, 2017Assignee: ASML NETHERLANDS B.V.Inventor: Edo Maria Hulsebos
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Publication number: 20150241791Abstract: A method involving obtaining first calibration vibration data relating to vibrations of the lithographic apparatus from a sensor that is part of the lithographic apparatus and obtaining second calibration vibration data, the second calibration vibration data being a component of first parameter data of the lithographic apparatus. A filter is calculated from the first and second calibration vibration data, the filter being such that when applied to the first calibration vibration data, its output correlates closer with the second calibration vibration data. The filter can then be applied to vibration data obtained using the first sensor to obtain an estimate of a vibration component of the first parameter data during the lithographic process.Type: ApplicationFiled: October 8, 2013Publication date: August 27, 2015Applicant: ASML NETHERLANDS B.V.Inventor: Edo Maria Hulsebos
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Patent number: 8208139Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.Type: GrantFiled: December 30, 2008Date of Patent: June 26, 2012Assignee: ASML Netherlands B.V.Inventors: Edo Maria Hulsebos, Franciscus Godefridus Casper Bijnen, Patrick Warnaar
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Patent number: 8208140Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.Type: GrantFiled: March 5, 2010Date of Patent: June 26, 2012Assignee: ASML Netherlands B.V.Inventors: Edo Maria Hulsebos, Franciscus Godefridus Casper Bijnen, Patrick Warnaar
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Publication number: 20100214550Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.Type: ApplicationFiled: March 5, 2010Publication date: August 26, 2010Applicant: ASML Netherlands B.V.Inventors: Edo Maria HULSEBOS, Franciscus Godefridus Casper Bijnen, Patrick Warnaar
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Publication number: 20090176167Abstract: A lithographic apparatus according to one embodiment of the invention includes an alignment system for aligning a substrate or a reticle. The alignment system includes a radiation source configured to illuminate an alignment mark on the substrate or on the reticle, the alignment mark comprising a maximum length sequence or a multi periodic coarse alignment mark. An alignment signal produced from the alignment mark is detected by a detection system. A processor determines an alignment position of the substrate or the reticle based on the alignment signal.Type: ApplicationFiled: December 30, 2008Publication date: July 9, 2009Applicant: ASML Netherlands B.V.Inventors: Edo Maria HULSEBOS, Franciscus Godefridus Casper Bijnen, Patrick Warnaar