Abstract: A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.

Abstract: A plated module is for an IC card and includes a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip intended to be hosted in a recess of a plastic support of the IC card. At least some of the conductive areas are connected to a corresponding contact points of the integrated circuit chip. At least some of the conductive areas are linked to corresponding extended areas by one or more bridges. The conductive areas are separated from the extended areas by an insulating channel crossed by the bridges. The insulating channels surround the conductive areas as a protection frame for the contact points. At least a major side of at least one of the conductive areas may be curved. Several of the advanced extended areas form a rounded border of the plated module.

Abstract: An IC card includes a plated or protective module including a printed circuit having a plurality of conductive areas, delimited by a network of insulating channels, for covering an integrated circuit chip, a plastic support with a recess intended to host the plated module and the integrated circuit chip, with at least some of the conductive areas connected to corresponding contact points on the integrated circuit chip. A plurality of extended areas are linked to a corresponding conductive areas by one or more bridges. A couple of advanced extended areas form a rounded border of the plated module. Advanced extended areas are linked to conductive areas not connected to contact points. Advanced extended areas wrap around the extended areas and form the opposite rounded sides of the plated module.