Patents by Inventor Edouard Da Cruz

Edouard Da Cruz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ULTRASOUND TRANSDUCER AND METHOD FOR WAFER LEVEL BACK FACE ATTACHMENT
    Publication number: 20200107814
    Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
    Type: Application
    Filed: December 4, 2019
    Publication date: April 9, 2020
    Inventors: Flavien Daloz, Jason Barrett, Edouard Da Cruz, Jean Pierre Malacrida
  • Ultrasound transducer and method for wafer level front face attachment
    Patent number: 10596598
    Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises: a piezoelectric layer, a matching layer, one surface of the matching layer is electrically coupled to a top surface of the piezoelectric layer and another surface of the matching layer forms a signal pad within a front face of the ultrasound transducer, and a base package electrically coupled to a bottom surface of the piezoelectric layer, the base package extending horizontally and laterally to form a back face of the ultrasound transducer parallel to the front face of the ultrasound transducer, and extending vertically relative to the back face of the ultrasound transducer to form a ground pad within the front face of the ultrasound transducer. In this way, the transducer can work robustly and may be automatically mounted to a flat substrate with printed circuit.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: March 24, 2020
    Assignee: General Electric Company
    Inventors: Flavien Daloz, Philippe Menage, Edouard Da Cruz, Jean Pierre Malacrida, Giandonato Stallone, Coraly Cuminatto
  • Ultrasound transducer and method for wafer level back face attachment
    Patent number: 10561398
    Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: February 18, 2020
    Assignee: General Electric Company
    Inventors: Flavien Daloz, Jason Barrett, Edouard Da Cruz, Jean Pierre Malacrida
  • ULTRASOUND TRANSDUCER AND METHOD FOR WAFER LEVEL BACK FACE ATTACHMENT
    Publication number: 20180175278
    Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises a front face, a back face parallel to the front face, a piezoelectric layer having a top surface electrically coupled to the signal pad and a bottom surface electrically coupled to the ground pad. In this way, the transducer can work robustly and may be automatically mounted to an imaging probe.
    Type: Application
    Filed: December 20, 2016
    Publication date: June 21, 2018
    Inventors: Flavien Daloz, Jason Barrett, Edouard Da Cruz, Jean Pierre Malacrida
  • ULTRASOUND TRANSDUCER AND METHOD FOR WAFER LEVEL FRONT FACE ATTACHMENT
    Publication number: 20180169701
    Abstract: Methods and systems are provided for a single element ultrasound transducer. In one embodiment, the ultrasound transducer comprises: a piezoelectric layer, a matching layer, one surface of the matching layer is electrically coupled to a top surface of the piezoelectric layer and another surface of the matching layer forms a signal pad within a front face of the ultrasound transducer, and a base package electrically coupled to a bottom surface of the piezoelectric layer, the base package extending horizontally and laterally to form a back face of the ultrasound transducer parallel to the front face of the ultrasound transducer, and extending vertically relative to the back face of the ultrasound transducer to form a ground pad within the front face of the ultrasound transducer. In this way, the transducer can work robustly and may be automatically mounted to a flat substrate with printed circuit.
    Type: Application
    Filed: December 20, 2016
    Publication date: June 21, 2018
    Inventors: Flavien Daloz, Philippe Menage, Edouard Da Cruz, Jean Pierre Malacrida, Giandonato Stallone, Coraly Cuminatto