Abstract: In one embodiment, a resonator device includes a substrate comprising a piezoelectric material and a set of electrodes on the substrate. The electrodes are in parallel and a width of the electrodes is equal to a distance between the electrodes. The resonator device further includes a set of switches, with each switch coupled to a respective electrode. The switches are to connect to opposite terminals of an alternating current (AC) signal source and select between the terminals of the AC signal source based on an input signal.

Abstract: The RF filters used in conventional mobile devices often include resonator structures, which often require free-standing air-gap structure to prevent mechanical vibrations of the resonator from being damped by a bulk material. A method for fabricating a resonator structure comprises depositing a non-conformal thin-film to the resonator structure to seal air gap cavities in the resonator structure.

Abstract: Techniques are disclosed implementing acoustic wave resonator (AWR) filter architectures to enable integrated solutions requiring significantly less passive components. The primary AWR filter topology leverages the use of parallel resonator branches, each having a relatively narrow bandwidth that may be combined to form an overall broadband filter response. This architecture may be further modified using electronically-controlled switching components to dynamically turn specific branches on or off to tune the filter, thus realizing a programmable broadband solution. Shunt resonators may also be added to the AWR filter topology, which may also be controlled with the use of electronically-controlled switching components to provide further control with respect to roll-off and the location and number of notch frequencies.

Abstract: The RF filters used in conventional mobile devices often include resonator structures, which often require free-standing air-gap structure to prevent mechanical vibrations of the resonator from being damped by a bulk material. A method for fabricating a resonator structure comprises depositing a non-conformal thin-film to the resonator structure to seal air gap cavities in the resonator structure.

Abstract: A surface acoustic wave (SAW) resonator structure, an integrated circuit, and a method of fabricating a SAW structure are provided. The method includes epitaxially growing a crystalline aluminum nitride piezoelectric film layer on a substrate; and deposing a plurality of electrodes on the piezoelectric film layer. The SAW structure includes a substrate, a piezoelectric film on the substrate, and a plurality of electrodes on the piezoelectric film.

Abstract: An electroabsorption vertical cavity surface emitting laser modulator and/or detector includes a lower reflector, an upper reflector, a middle reflector, a gain region, and an absorber region integrated into a semiconductor die. The middle reflector is disposed between the lower and upper reflectors. Together, the lower and middle reflectors define a first resonant cavity within the semiconductor die, while the upper and middle reflectors define a second resonant cavity within the semiconductor die. The first and second resonant cavities are optically coupled. The gain region is disposed within the first resonant cavity and is capable of generating an optical carrier wave. The absorber region is disposed within the second resonant cavity and is capable of modulating a signal on the optical carrier wave when subjected to a signal voltage.

Abstract: A system is disclosed. The system includes a printed circuit board (PCB), a substrate mounted on the PCB, an integrated circuit (IC) mounted on the substrate, an optoelectronic sub-assembly mounted on the substrate and coupled to the IC; and a waveguide patterned on the substrate.

Abstract: Self alignment of Optoelectronic (OE) chips, such as photodiode (PD) modules and vertical cavity surface emitting laser (VCSEL) modules, to external waveguides or fiber arrays may be realized by packaging the OE chips directly in the fiber optic connector.