Abstract: Embodiments of claimed subject matter are directed to a malleable and integrally illuminated surgical retractor. In an embodiment, a malleable steel strip, having a thickness approximately in the range of 0.5-1.0 mm, may form a substrate. An elastically deformable layer, such as a polymeric layer, may be secured to the malleable steel strip. One or more meandering conductive lines, spiral conductors, or conductive inks, which may elongate and/or compress during bending of the substrate, may be secured to the TPU layer. The one or more meandering conductive lines, spiral conductors, or conductive inks may operate to couple current from an electronics module to one or more malleable illumination sources comprising, for example, an organic light-emitting diode (OLED).

Abstract: A method for manufacturing a electronic device is provided having a current collector capable of a high specific charge collecting area and power, but is also achieved using a simple and fast technique and resulting in a robust design that may be flexed and can be manufactured in large scale processing. To this end the electronic device comprising an electronic circuit equipped with a current collector formed by a metal substrate having a face forming a high-aspect ratio structure of pillars having an interdistance larger than 600 nm. By forming the high-aspect structure in a metal substrate, new structures can be formed that are conformal to curvature of a macroform or that can be coiled or wound and have a robust design.

Abstract: The invention aims to provide a contactless method to create small conductive tracks on a substrate. To this end a method is provided for selective material deposition, comprising depositing a first material on a substrate; followed by solidifying the first material selectively in a first solidified pattern by one or more energy beams; and followed by propelling non-solidified material away from the substrate by a large area photonic exposure, controlled in timing, energy and intensity to leave the solidified first pattern of the first material.

Abstract: A method and apparatus for light induced selective transfer of components. A donor substrate (10) with a plurality of components (11,12) divided in different subsets arranged according to respective layouts (A,B). A target substrate (20) comprises recesses (21) and protrusions (25). The donor and target substrates (10,20) are aligned such that a first subset of components (11) is suspended over corresponding recesses (21) in the target substrate (20) and a second subset of components (12) is in contact with corresponding protrusions (25) of the target substrate (20). Light (L) is projected onto the donor substrate (10) to transfer the first subset of components (11) across and into the corresponding recesses (21) while the second subset of components (12) remains attached to the donor substrate (10).

Abstract: A printed temperature sensor (10) comprising a substrate (1) with an electrical circuit (2) comprising a pair of electrodes (2a, 2b) separated by an electrode gap (G). A sensor material (3) is disposed between the electrodes (2a, 2b) to fill the electrode gap (G), wherein the sensor material (3) comprises semi-conducting micro-particles (3p) comprising an NTC material with a negative temperature coefficient (NTC), wherein the micro-particles (3p) are mixed in a dielectric matrix (3m) functioning as a binder for printing the sensor material (3); wherein the micro-particles (3p) contact each other to form an interconnected network through the dielectric matrix (3m), wherein the interconnected network of micro-particles (3p) acts as a conductive pathway with negative temperature coefficient between the electrodes (2a, 2b).

Abstract: Embodiments of claimed subject matter are directed to an illuminating surgical device comprising a single control element to control an array of illuminating elements and an array of louvers to direct light from the individual illuminating elements toward a surgical field.

Abstract: A printed temperature sensor (10) comprising a substrate (1) with an electrical circuit (2) comprising a pair of electrodes (2a, 2b) separated by an electrode gap (G). A sensor material (3) is disposed between the electrodes (2a, 2b) to fill the electrode gap (G), wherein the sensor material (3) comprises semi-conducting micro-particles (3p) comprising an NTC material with a negative temperature coefficient (NTC), wherein the micro-particles (3p) are mixed in a dielectric matrix (3m) functioning as a binder for printing the sensor material (3); wherein the micro-particles (3p) contact each other to form an interconnected network through the dielectric matrix (3m), wherein the interconnected network of micro-particles (3p) acts as a conductive pathway with negative temperature coefficient between the electrodes (2a, 2b).

Abstract: Embodiments of claimed subject matter are directed to a malleable and integrally illuminated surgical retractor. In an embodiment, a malleable steel strip, having a thickness approximately in the range of 0.5-1.0 mm, may form a substrate. An elastically deformable layer, such as a polymeric layer, may be secured to the malleable steel strip. One or more meandering conductive lines, spiral conductors, or conductive inks, which may elongate and/or compress during bending of the substrate, may be secured to the TPU layer. The one or more meandering conductive lines, spiral conductors, or conductive inks may operate to couple current from an electronics module to one or more malleable illumination sources comprising, for example, an organic light-emitting diode (OLED).

Abstract: A method and system for heat bonding a chip to a substrate by means of heat bonding material disposed there between. At least the substrate is preheated from an initial temperature to an elevated temperature below a damage temperature of the substrate. A light pulse applied to the chip momentarily increases the chip temperature to a pulsed peak temperature below a peak damage temperature of the chip. The momentarily increased pulsed peak temperature of the chip causes a flow of conducted heat from the chip to the bonding material, causing the bonding material to form a bond.

Abstract: The present disclosure concerns an electrical circuit pattern on a substrate, as well as a method and system for forming same. In a typical embodiment, a light pattern is projected through a transparent layer to cause a patterned release of adhesion between a continuous material layer and the transparent layer. A release layer adhered to the patterned material layer is pulled off the substrate to separate the material having lower adhesion while leaving the material that was not exposed to form the electrical circuit pattern thereon.

Abstract: The present disclosure concerns a method and system for providing a patterned structure (3p) on an acceptor substrate 4). The method comprises providing a donor substrate (10) arranged between a light source (5) and an acceptor substrate (4). A mask (7) is arranged between the light source (5) and the donor substrate (10). The mask (7) comprises a mask pattern (7p) for patterning light (6). The patterned light (6p) impinging the donor substrate (10) causes the donor material (3) to be released from the donor substrate (10) and transfer to the acceptor substrate (4) to form the patterned structure (3p) thereon. The patterned light (6p) is divided by the mask pattern (7p) into a plurality of separate homogeneously sized beams (6b) simultaneously impinging the donor substrate (10) for causing the donor material (3) to be released from the donor substrate (10) in the form of separate homogeneously sized droplets (3d).

Abstract: A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).

Abstract: An apparatus and method for soldering chips to a substrate. A substrate and two or more different chips having different heating properties are provided. A solder material is disposed between the chips and the substrate. A flash lamp generates a light pulse for heating the chips, wherein the solder material is at least partially melted by contact with the heated chips. A masking device is disposed between the flash lamp and the chips causing different light intensities in different areas of the light pulse passing the masking device thereby heating the chips with different light intensities. This may compensate the different heating properties to reduce a spread in temperature between the chips as a result of the heating by the light pulse.

Abstract: Embodiments of claimed subject matter are directed to an illuminating surgical device comprising an array of illuminating elements and an array of louvers to direct light from the individual illuminating elements toward a surgical field.

Abstract: Embodiments of claimed subject matter are directed to an illuminating surgical device comprising a single control element to control an array of illuminating elements and an array of louvers to direct light from the individual illuminating elements toward a surgical field.

Abstract: A substrate (3) and two or more different chips (1a, 1b) having different heating properties (e.g. caused by different dimensions (surface area and/or thickness), heat capacity (C1, C2), absorptivity, conductivity, number and/or size of solder bonds) are provided. A solder material (2) is disposed between the chips (1a, 1b) and the substrate (3). A flash lamp (5) generates a light pulse (6) for heating the chips (1a, 1b), wherein the solder material (2) is at least partially melted by contact with the heated chips (1a, 1b). A masking device (7) is disposed between the flash lamp (5) and the chips (1a, 1b) causing different light intensities (1a, 1b) in different areas (6a, 6b) of the light pulse (6) passing the masking device (7), thereby heating the chips (1a, 1b) with different light intensities (1a, 1b). This may compensate the different heating properties to reduce a spread in temperature between the chips (1a, 1b) as a result of the heating by the light pulse (6).

Abstract: Embodiments of claimed subject matter are directed to a malleable and integrally illuminated surgical retractor. In an embodiment, a malleable steel strip, having a thickness approximately in the range of 0.5-1.0 mm, may form a substrate. An elastically deformable layer, such as a polymeric layer, may be secured to the malleable steel strip. One or more meandering conductive lines, spiral conductors, or conductive inks, which may elongate and/or compress during bending of the substrate, may be secured to the TPU layer. The one or more meandering conductive lines, spiral conductors, or conductive inks may operate to couple current from an electronics module to one or more malleable illumination sources comprising, for example, an organic light-emitting diode (OLED).

Abstract: An method for manufacturing a electronic device is provided having a current collector capable of a high specific charge collecting area and power, but is also achieved using a simple and fast technique and resulting in a robust design that may be flexed and can be manufactured in large scale processing. To this end the electronic device comprising an electronic circuit equipped with a current collector formed by a metal substrate having a face forming a high-aspect ratio structure of pillars having an interdistance larger than 600 nm. By forming the high-aspect structure in a metal substrate, new structures can be formed that are conformal to curvature of a macroform or that can be coiled or wound and have a robust design.

Abstract: A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).

Abstract: Method and apparatus for assembling a component with a flexible foil, as well as assembled product A method is provided for assembling a component (20) with a flexible foil (10). The method comprising the steps of —providing (SI) a flexible foil (10) having a first side (11) with at least one liquid confinement zone (12) and at least one liquid confinement subzone (13) enclosed by the liquid confinement zone, —depositing (S2) an alignment liquid (30) in the at least one liquid confinement subzone (13), —moving (S3) the component (20) towards the liquid confinement zone, and bringing (S4) a surface (21) of the component facing the flexible foil into contact with the alignment liquid in the at least one liquid confinement subzone and releasing (S5) the component (20).