Abstract: Method for sputtering from a dielectric target (9) in a vacuum chamber (2) with a high frequency gas discharge, the target (9) being mounted on a cooled metallic back plate (10) and this back plate forming an electrode (10) supplied with high frequency, includes a target thickness (Td) profiled (15) differently over the surface such that in the regions of a desired decrease of the sputtering rate the target thickness (Td) is selected to be greater than in the remaining regions.

Abstract: The invention relates to a vacuum sputter method for producing dielectric layers. The aim of said invention is to obtain a good distribution of said layers over the substrate to be coated, in a reproducible manner over the entire service life of the target (9) to be sputter-coated. To achieve this, the thickness of the dielectric target (9), which is sputter-coated using a high frequency, is profiled. Said profiles are chosen in such a way that the target thickness is greater in the area of increased erosion rates and/or smaller in the area of lower erosion rates.