Abstract: Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die between a top substrate layer and a bottom substrate layer. The top substrate layer may include a via and the active die may include a die pad. An anisotropic conductive layer may be disposed between the via and the die pad to conduct electrical current unidirectionally between the via and the die pad. In an embodiment, the active die is a flash memory controller and a memory die is mounted on the top substrate layer and placed in electrical communication with the flash memory controller through the anisotropic conductive layer.

Abstract: In some examples, a device can control an HVAC system within a building. Includes an analog display including a set of markers, and where each marker of the set of markers corresponds to a respective parameter value of a parameter associated with the building; an electric motor; a pointer connected to the electric motor, where the electric motor is configured to rotate the pointer within a pointer range from a lower limit to an upper limit; and processing circuitry. The processing circuitry is configured to: determine a position of the electric motor while the pointer is positioned at one of the lower limit or the upper limit of the pointer range; and calibrate, a position function corresponding to the electric motor.

Abstract: Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die between a top substrate layer and a bottom substrate layer. The top substrate layer may include a via and the active die may include a die pad. An anisotropic conductive layer may be disposed between the via and the die pad to conduct electrical current unidirectionally between the via and the die pad. In an embodiment, the active die is a flash memory controller and a memory die is mounted on the top substrate layer and placed in electrical communication with the flash memory controller through the anisotropic conductive layer.

Abstract: Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die between a top substrate layer and a bottom substrate layer. The top substrate layer may include a via and the active die may include a die pad. An anisotropic conductive layer may be disposed between the via and the die pad to conduct electrical current unidirectionally between the via and the die pad. In an embodiment, the active die is a flash memory controller and a memory die is mounted on the top substrate layer and placed in electrical communication with the flash memory controller through the anisotropic conductive layer.

Abstract: Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die between a top substrate layer and a bottom substrate layer. The top substrate layer may include a via and the active die may include a die pad. An anisotropic conductive layer may be disposed between the via and the die pad to conduct electrical current unidirectionally between the via and the die pad. In an embodiment, the active die is a flash memory controller and a memory die is mounted on the top substrate layer and placed in electrical communication with the flash memory controller through the anisotropic conductive layer.

Abstract: Disclosed is a die stack. The die stack may include a first plurality of dies and a second plurality of dies. Each of the plurality of dies may define a plurality of vias passing from a first side to a second side of the die. The plurality of dies may be stacked such that each of the plurality of vias in a first die are collinear with a respective via in a second die. At least one of the second plurality of dies may be wire bonded to at least one of the first plurality of dies.

Abstract: Semiconductor packages including active package substrates are described. In an example, the active package substrate includes an active die and an interposer embedded within a substrate laminate. The active die may be mounted on the interposer, and die pads of the active die may be electrically connected to a first contact array of the interposer. Accordingly, signal routing of the interposer may fan out an electrical signal from the embedded die pads to several vias in the substrate laminate. One or more memory dies of a memory stack may be mounted on substrate laminate and may be electrically connected to the vias. Accordingly, the embedded active die may control the memory stack.

Abstract: Various embodiments disclosed relate to a semiconductor package. The semiconductor package includes a substrate having first and second opposed major surfaces. The substrate further includes a cavity having a first end defined by a portion of the first major surface and a second end defined by a portion of the second major surface. The semiconductor package further includes a first electronic component attached to the first major surface. The first electronic component substantially covers the first end of the cavity. A second electronic component is at least partially disposed within the cavity.

Abstract: Disclosed is a die stack. The die stack may include a first plurality of dies and a second plurality of dies. Each of the plurality of dies may define a plurality of vias passing from a first side to a second side of the die. The plurality of dies may be stacked such that each of the plurality of vias in a first die are collinear with a respective via in a second die. At least one of the second plurality of dies may be wire bonded to at least one of the first plurality of dies.

Abstract: A frame mounted vehicle lift system and method of use are described. The system and method of use are designed to provide a simple, reliable, and safe means for persons operating a motor vehicle to elevate one or more of the vehicle's wheels from the ground for a variety of purposes, such as changing a flat tire, for example. The system comprises one or more frame-mounted vehicle jacks and an automatic spare tire dispenser. Components of the invention are driven by actuators powered by the vehicle's battery and activated by a dashboard or other switch on the vehicle, or remotely by a FOB.

Abstract: A frame mounted vehicle lift system and method of use are described. The system and method of use are designed to provide a simple, reliable, and safe means for persons operating a motor vehicle to elevate one or more of the vehicle's wheels from the ground for a variety of purposes, such as changing a flat tire, for example. The system comprises one or more frame-mounted vehicle jacks and an automatic spare tire dispenser. Components of the invention are driven by actuators powered by the vehicle's battery and activated by a dashboard or other switch on the vehicle, or remotely by a FOB.

Abstract: It offers an insulated electrical cable to be used mainly but not exclusively as an underground electricity conductor buried directly, characterized by including basically the functional technical combination of: central conductor wires practically arranged in a cylindrical circular pattern; an interior cylindrical lining that covers the central conductor wires and essentially provides the function of electric insulation, and an exterior lining also practically cylindrical and concentric with the aforementioned elements which carries inside a number of ribs that remain in contact with or tangential to the interior lining, separated by grooves, that provides additional insulation, mechanical protection and protection against environmental elements and accidental blows.