Patents by Inventor EDUARDO PAULO LIMA

EDUARDO PAULO LIMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for depositing a material
    Patent number: 11875980
    Abstract: A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields. In the method, a sputtering material is sputtered from a target, wherein the target and the substrate are separated by a gap in the range 2.5 to 10 cm and a secondary magnetic field is produced within the chamber which causes a plasma produced by the pulsed DC magnetron device to expand towards one or more walls of the chamber.
    Type: Grant
    Filed: December 31, 2020
    Date of Patent: January 16, 2024
    Inventors: Stephen R Burgess, Rhonda Hyndman, Amit Rastogi, Eduardo Paulo Lima, Clive L Widdicks, Paul Rich, Scott Haymore, Daniel Cook
  • Method and Apparatus for Depositing a Material
    Publication number: 20210123130
    Abstract: A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields. In the method, a sputtering material is sputtered from a target, wherein the target and the substrate are separated by a gap in the range 2.5 to 10 cm and a secondary magnetic field is produced within the chamber which causes a plasma produced by the pulsed DC magnetron device to expand towards one or more walls of the chamber.
    Type: Application
    Filed: December 31, 2020
    Publication date: April 29, 2021
    Inventors: Stephen R Burgess, Rhonda Hyndman, Amit Rastogi, Eduardo Paulo Lima, Clive L Widdicks, Paul Rich, Scott Haymore, Daniel Cook
  • Method and apparatus for depositing a material
    Patent number: 10900114
    Abstract: A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields. In the method, a sputtering material is sputtered from a target, wherein the target and the substrate are separated by a gap in the range 2.5 to 10 cm and a secondary magnetic field is produced within the chamber which causes a plasma produced by the pulsed DC magnetron device to expand towards one or more walls of the chamber.
    Type: Grant
    Filed: March 30, 2016
    Date of Patent: January 26, 2021
    Inventors: Stephen R Burgess, Rhonda Hyndman, Amit Rastogi, Eduardo Paulo Lima, Clive L Widdicks, Paul Rich, Scott Haymore, Daniel Cook
  • METHOD AND APPARATUS FOR DEPOSITING A MATERIAL
    Publication number: 20160289815
    Abstract: A method is for depositing a dielectric material on to a substrate in a chamber by pulsed DC magnetron sputtering with a pulsed DC magnetron device which produces one or more primary magnetic fields. In the method, a sputtering material is sputtered from a target, wherein the target and the substrate are separated by a gap in the range 2.5 to 10 cm and a secondary magnetic field is produced within the chamber which causes a plasma produced by the pulsed DC magnetron device to expand towards one or more walls of the chamber.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 6, 2016
    Inventors: STEPHEN R. BURGESS, RHONDA HYNDMAN, AMIT RASTOGI, EDUARDO PAULO LIMA, CLIVE L. WIDDICKS, PAUL RICH, SCOTT HAYMORE, DANIEL COOK