Patents by Inventor Edvard König

Edvard König has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230396016
    Abstract: A cooling system for a personal computer includes at least one cooling device using electrical power, and a wiring. The wiring has a male connector, a female connector, at least one first wire arrangement, and at least one second wire arrangement. The first and second wire arrangements electrically connect the male connector to the cooling device, the female connector to the cooling device, and the male connector to the female connector. The first wire arrangement is configured to electrically connect the cooling device to a ground, and the second wire arrangement is configured to electrically connect the cooling device to a power supply.
    Type: Application
    Filed: September 20, 2022
    Publication date: December 7, 2023
    Applicant: EKWB d.o.o.
    Inventor: Edvard König
  • Publication number: 20210247151
    Abstract: A fluid-based cooling device for cooling at least two distinct first heat-generating elements of a heat source assembly is provided. The heat source assembly is in thermal contact with the fluid-based cooling device. The fluid-based cooling device comprises a first plate, a heat sink structure and a second plate. The first plate is configured for thermally contacting the heat source assembly. The heat sink structure is arranged on or in the first plate. The second plate is configured for directing a flow of a cooling fluid to the heat sink structure. The second plate is arranged on the heat sink structure. The heat sink structure comprises at least two heat sink structure portions each corresponding to an associated one of the at least two distinct first heat-generating elements. The second plate comprises at least two fluid inlet opening regions, wherein each of the fluid inlet opening regions is associated with a corresponding heat sink structure portion of the at least two heat sink structure portions.
    Type: Application
    Filed: April 29, 2019
    Publication date: August 12, 2021
    Applicant: EKWB d.o.o.
    Inventors: Edvard König, Daniel George Harper