Abstract: Conventional foamable cavity sealing articles are susceptible to sagging when expanded in a vertical orientation with the foaming material facing downwards, because of gravitational drag on the molten material during expansion. The problem is particularly pronounced in foaming materials formulated to have high expansion ratios and low melt viscosities. A solution to the problem is presented in the form of a cavity sealing article having a planar holder and a foamable sealer, the foamable sealer circumscribing the edge of the support member. This construction creates a gripping effect which prevents sagging of the sealing member during expansion.

Abstract: A cavity sealing article comprises(a) a planar support member; and(b) a sealing member comprising a foamable polymer surrounding and in intimate contact with the support member in the plane of the support member, the sealing member comprising at least two layers in intimate contact in the plane of the support member,the outermost of the layers comprising an uncrosslinked foamable polymer, andan inner layer comprising a crosslinked foamable polymer.

Abstract: A single turn induction heating coil provides a varied magnetic flux density for heating a portion of a load having a thermally and magnetically responsive sealant and tubing. The varied interior diameter of the cylindrical coil structure increases the magnetic flux density at the open ends of the coil or wherever desired, causing the ends of the magnetically responsive materials contained within the coil to be heated at a rate comparable to the middle portion of the coil. Consequently, the sealant and tubing recover faster and more uniformly avoiding the high incidence of tubing "flare up" or "flip back" common with typical single or multi-turn induction coil heaters. In the preferred application, heating produces a complete fluid block in a cable load section within the coil without overheating or damaging the load.

Abstract: The invention provides a mounting assembly comprising an electronic module and a rack for receiving the module. The assembly includes an actuator arranged to cause the module to slide along the rack into engagement with an end stop, and subsequently to actuate means arranged to force a surface of the module against a surface of the rack, for example to make a heat sink link. The actuator preferably comprises a shape memory alloy element.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member containing a fusible solder insert, solder flux and a thermochromic composition which undergoes a visible change from a colored to a colorless state at the soldering temperature. Solderable substrates are positioned within the device and heat is applied until the soldering temperature has been reached, as indicated by a color change of the thermochromic composition. The soldering temperature is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Typically this temperature is at least about 20.degree. C. above the melting temperature of the solder.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.

Abstract: A heat-recoverable soldering device comprises a heat-recoverable member having a fusible solder insert and associated with the solder insert, a solder flux composition which undergoes a visible color change at a critical temperature. Solderable substrates are positioned within the device and heated until a critical temperature has been reached as indicated by a color change in the flux. The critical temperature depends on the material of the particular heat-recoverable member and the solder used. It is that temperature which is required to effect a solder joint between the substrates and recovery of the heat-recoverable member. Novel flux compositions and their use in soldering are also disclosed.