Abstract: A radio frequency connector assembly may include a first RF connector that includes a tubular electrically conductive body having a radially compressible end, and a second RF connector that includes an electrically conductive housing having a passageway therethrough. The passageway may define a throat segment having a constant diameter equal to or larger than the radially compressible end and a contact ramp segment adjacent the throat segment and configured to compress the radially compressible end. The contact ramp segment may have a progressively decreasing diameter defining a curvature. The passageway may also define a medial segment having a constant diameter equal to a diameter of an adjacent portion of the contact ramp segment, and a capture segment adjacent the medial segment having a diameter larger than the medial segment. A dielectric body may be carried by the housing supporting an electrically conductive pin.

Abstract: A radio frequency connector assembly may include a first RF connector that includes a tubular electrically conductive body having a radially compressible end, and a second RF connector that includes an electrically conductive housing having a passageway therethrough. The passageway may define a throat segment having a constant diameter equal to or larger than the radially compressible end and a contact ramp segment adjacent the throat segment and configured to compress the radially compressible end. The contact ramp segment may have a progressively decreasing diameter defining a curvature. The passageway may also define a medial segment having a constant diameter equal to a diameter of an adjacent portion of the contact ramp segment, and a capture segment adjacent the medial segment having a diameter larger than the medial segment. A dielectric body may be carried by the housing supporting an electrically conductive pin.

Abstract: A cable end termination is for a coaxial cable that includes inner and outer conductors and a dielectric layer therebetween that is subject to outgassing in a vacuum environment. The cable end termination may include a tubular bi-metallic body that includes a first longitudinal portion including a first metal and a second longitudinal portion joined with the first longitudinal portion and that includes a second metal having a different coefficient of thermal expansion (CTE) than the first metal. The tubular bi-metallic body may have a first end receiving the coaxial cable and a second end opposite the first end that carries a dielectric body to define a hermetic seal for the dielectric layer in the vacuum environment. A center pin contact may extend through the dielectric body, and a center conductor contact may couple the center pin contact to the inner conductor.

Abstract: A cable end termination is for a coaxial cable that includes inner and outer conductors and a dielectric layer therebetween that is subject to outgassing in a vacuum environment. The cable end termination may include a tubular bi-metallic body that includes a first longitudinal portion including a first metal and a second longitudinal portion joined with the first longitudinal portion and that includes a second metal having a different coefficient of thermal expansion (CTE) than the first metal. The tubular bi-metallic body may have a first end receiving the coaxial cable and a second end opposite the first end that carries a dielectric body to define a hermetic seal for the dielectric layer in the vacuum environment. A center pin contact may extend through the dielectric body, and a center conductor contact may couple the center pin contact to the inner conductor.

Abstract: A multi feed-through pin electrical connector has a pin-count layout that corresponds to the form factor of the pin layout of a micro-size (e.g., nano-type) multipin connector, but contains only a relatively small number of feed-through pins, locations of which are those of selected pins of the micro-sized multipin connector. This allows adjacent pin locations of the relatively small pin-count layout to be spaced farther apart from each other than pin locations of conventional micro-sized multipin connectors, so that the available wire-connection surface areas of the interior ends of the feed-through pins may be substantially increased relative to those of conventional micro-sized multipin connectors, and thereby facilitate secure wire-bonding to the interior ends of the pins.

Abstract: Electronics packages having a primary metallic material, such as a titanium metallic material, metallurgically bonded to one or more secondary regions within the primary metallic material, the composite regions having desirable thermal conductivity properties and having a coefficient of thermal expansion (“CTE”) that generally matches the CTE of the primary metallic material are provided. Electronics packages comprising titanium having heat sinks comprising a metal matrix material such as aluminum silicon carbide or a composite metallic structure such as titanium aluminide/copper, are described. Methods for manufacturing electronics packages having a composite structure are also disclosed.

Abstract: Composite materials are composed of a primary metallic base material, such as a titanium metallic material, metallurgically bonded to one or more secondary materials having desirable thermal conductivity properties and having a coefficient of thermal expansion (“CTE”) that generally matches the CTE of the primary metallic material. An exemplary composite material is composed of a titanium primary material metallurgically bonded to a secondary metal matrix composite material having a high thermal conductivity, such as aluminum silicon carbide. Methods for manufacturing such composite materials are disclosed.

Abstract: A microwave electronics package has a microwave waveguide window assembly hermetically sealed to the electronics package using an intermediate bimetallic bushing. The metallic components of the bimetallic bushing have thermal properties similar to the thermal properties of the housing and waveguide window frame, respectively, permitting the use of fusion welding techniques such as laser welding to hermetically seal the waveguide assembly in the housing and to preserve the integrity of the waveguide window during fusion welding and during thermal cycling of the electronics package. A microwave grounding element is also provided in the assembled electronics package to provide a continuous microwave ground path.

Abstract: Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The apparatus of the present invention are especially suitable for hermetically sealing metal matrix composite electronics packages.

Abstract: Apparatus and methods for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The methods and apparatus of the present inventions are especially suitable for hermetically sealing metal matrix composite electronics packages.

Abstract: Connectors are provided which afford a substantial material match between two dissimilar metals, such as between an electronics package and the connector as well as between connector components to form an electronics assembly. In this manner, the thermal expansion properties of the electronics assembly components to be interfaced are also substantially matched, thereby allowing maintenance of a hermetic feedthru formed therebetween for a sustained period of operation. Additionally, the substantially matched component materials permit the use of simple and cost effective interfacing procedures in assembly construction.