Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.

Abstract: Examples described herein relate to a security system consistent with the disclosure. For instance, the security system may comprise a sensor interface bridge connecting a gateway to an input/output (I/O) card, a Field Programmable Gate Array (FPGA) to scan data to detect an anomaly in the data while the data is in the sensor interface bridge, where a learning neural network accelerator Application-Specific Integrated Circuit (ASIC) is integrated with the FPGA and send the data without an anomaly to the gateway.

Abstract: Systems and methods are provided for enabling coexistence of Information Technology (IT) systems and Operational Technology (OT) systems, where advanced computing functionality realized by the IT systems can be applied to legacy applications and incumbent hardware technologies resident in the OT systems. A distributed control node (DCN) implemented between the IT and OT systems may comprise a microcontroller system partitioned into two processor clusters. Microservices associated with the IT systems are provisioned to a high performance processor cluster, and legacy applications running bare metal associated with the OT systems are provisioned to a real-time processor cluster. Partitioning of the microcontroller system allows for interoperability between the microservices and the legacy applications.

Abstract: Examples include a computing system including a heater element for heating a processor device installed in the computing system. The computing system includes a chassis, a circuit board assembly housed in the chassis and a heat sink assembly disposed on the chassis to form a cover of the chassis. The circuit board assembly includes a processor package including a substrate having a first portion and a second portion. The processor package includes the processor device disposed on the first portion of the substrate. The heater element disposed on the second portion of the substrate. In the computing system, the heat sink assembly is disposed on the chassis such that a gap separates the heat sink assembly and the heater element.

Abstract: A universal industrial I/O interface bridge is provided. The universal industrial I/O interface bridge may be placed between a host and I/O interface cards to translate and manage electronic communications from these and other sources. Embodiments of the application may include (1) an improved hardware module, (2) an I/O discovery process to dynamically reprogram the universal industrial I/O interface bridge depending on the attached I/O card, (3) an abstraction process to illustrate the universal industrial I/O interface bridge and the physical I/O interfaces, (4) an alert plane within the universal industrial I/O interface bridge to respond to I/O alert pins, and (5) a secure distribution process for a firmware update of the universal industrial I/O interface bridge.

Abstract: Examples described herein relate to a security system consistent with the disclosure. For instance, the security system may comprise a sensor interface bridge connecting a gateway to an input/output (I/O) card, a Field Programmable Gate Array (FPGA) to scan data to detect an anomaly in the data while the data is in the sensor interface bridge, where a learning neural network accelerator Application-Specific Integrated Circuit (ASIC) is integrated with the FPGA and send the data without an anomaly to the gateway.

Abstract: A system includes a first server including a first optical communication system and a first control system, and a second server including a second optical communication system and a second control system. The first and second control systems optically communicates with each other using the first and second optical communication systems, and the second control system is configured to control a temperature of the first and second servers by controlling airflow from the first server to the second server.

Abstract: A fuze for accurately sensing the distance to a target irrespective of the resence of a medium intermediate of the fuze and the target. The fuze includes a source of radiation which is transmitted to the target and a detector which detects the backscatter from the target and intervening media. The detector output is amplified in an amplifier connected thereto and filtered in a filter connected to the amplifier to provide an output signal which is threshold detected in a threshold device connected to the amplifier. The threshold detected signal is applied to a firing circuit to provide a signal responsive to a predetermined distance above the target.