Abstract: A traveling wave tube having an electron gun and a collector assembly is provided. The assemblies include a sleeve placed around an isolator. The sleeve is either heat shrunk or heat deformed around the isolator. Heat shrinking is performed when the sleeve radius is initially larger than the isolator radius. During heat shrinking, the sleeve is heated to cause the sleeve radius to increase and be larger than the isolator radius. The sleeve is then placed around the isolator and cooled causing the sleeve to contract upon the isolator. Heat deformation is performed when the sleeve radius is initially smaller than the isolator radius. During heat deformation, the isolator is inserted into the sleeve. The isolator and the sleeve are then heated so that the sleeve expands to a constrained amount of expansion and then deforms. The sleeve and the isolator are then cooled causing the sleeve to contract upon the isolator.

Abstract: A traveling wave tube apparatus and method is disclosed. The traveling wave tube includes a slow wave structure such as a helix member. The helix member has an input end for receiving a microwave input signal having a selected power level and an output end for supplying a microwave output signal having a given power level. A microwave source is connected to the input end of the helix member for applying the microwave input signal to the helix member. An electron gun assembly is adjacent the input end of the helix member and has a cathode for injecting electrons as an electron beam through the helix member. A collector assembly is adjacent the output end of the helix member and has at least four collector electrodes for collecting the electrons in the electron beam. The power level of the microwave input signal is selected such that the given power level of the microwave output signal is at least 3 dB lower than the power level of the microwave output signal at saturation.

Abstract: A traveling wave tube and method of operation is disclosed. The traveling wave tube includes a slow wave structure such as a helix member provided with input and output ends and located within a tube member. An electron gun assembly is adjacent the input end for injecting electrons as an electron beam along an axial path through the helix member. A magnetic focusing device generates a magnetic field having a given strength to confine the beam to the axial path. The given strength of the magnetic field is sufficient to confine the beam only when the power level of the microwave input signal is selected such that the given power level of the microwave output signal is at least 6 dB lower than the power level of the microwave output signal at saturation. Boron Nitride (BN) supporting rods are engaged between the tube and helix members for supporting and transferring heat away from the helix member.

Abstract: The present invention comprises an improvement in the surface treatment of copper surfaces. It produces a strong and stable bond, resistant to chemical attack and to thermal and mechanical stresses between said copper foil surfaces and adjacent surfaces of resinous layers. It is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. In a method according to the invention, an oxidized cooper surface is reduced in the presence of a polymer addition agent, and the partially reduced surface is then exposed to a nonoxidizing reagent. The result is a reticulated metallic copper microstructure capable of forming a strong adhesive bond with a resinous substrate, and having a high resistance to thermal, mechanical, and chemical (e.g. acid) stress.

Abstract: The present invention comprises an improvement in the surface treatment of copper surfaces. It produces a strong and stable bond, resistant to chemical attack and to thermal and mechanical stresses between said copper foil surfaces and adjacent surfaces of resinous layers. It is especially useful in multilayer printed circuit fabrication and in the treatment of copper circuit lines and areas which are disconnected from each other, that is, which do not have electrically conductive continuity. In a method according to the invention, an oxidized copper surface is reduced in the presence of a polymer addition agent, and the partially reduced surface is then exposed to a nonoxidizing reagent. The result is a reticulated metallic copper microstructure capable of forming a strong adhesive bond with a resinous substrate, and having a high resistance to thermal, mechanical, and chemical (e.g. acid) stress.

Abstract: Apparatus for measuring gas pressures in vacuum type devices such as traveling-wave tubes is disclosed including an elongated hollow tube with negatively biased electrodes at each end. An axial magnetic field is induced in the chamber, and electrons are injected into the chamber and caused to travel in a confined beam substantially longitudinally between the two electrodes. Electrons will randomly hit gas molecules within the chamber and be deflected outwardly in stepped fashion to the wall of the tube. Electrons impinging upon the tube wall form a current dependent upon the gas pressure within the chamber. A current meter attached to the tube and calibrated as a function of pressure indicates the gas pressure.

Abstract: A resinous product is disclosed which possesses a resinous surface coatable with a layer of metal which can be bonded through an array of microdendrites extending below the resinous surface. The resinous products are prepared by coating the surface of a metal plate with microdendrites, pressing the microdendrite covered metal surface into the resinous surface, curing the resin and stripping away the plate to leave the microdendrites embedded in the cured resinous surface. The embedded microdendrites are dissolved away to produce a micro-rough resinous surface having an array of microdendrite-shaped cavities. The resinous product can be used for printed circuits and the like.

Abstract: The apparatus for electrodeposition of a metal includes a cylindrical cathode which is rotated about a horizontal axis and is partly submerged in an electrolyte, the cylindrical cathode having a surface layer thereon upon which metal from the electrolyte may be deposited and from which a deposited layer of the metal may be stripped, comprising a plurality of strips of dimensionally stable anode, means for supporting each of the plurality of strips parallel to the horizontal axis and spaced a predetermined distance from the surface layer to form a generally annular space between the surface and the plurality of strips extending about substantially the entire portion of the surface layer which is submerged in the electrolyte.

Abstract: A drum for copper foil production by an electrodeposition method is composed of an inner support cylinder formed of a copper alloy material having both high electrical conductivity and good elastic properties, and an outer cylinder formed of titanium, zirconium or tantalum having good stripping characteristics which has been shrunk fit to the support cylinder. The support cylinder is provided with spaced raised portions. The alloy used to form the support cylinder is also chosen to have a substantially higher coefficient of expansion than titanium, zirconium, or tantalum.As a result of this shrink fitting process, the cylinder of titanium, zirconium or tantalum is biased into intimate contact with the raised portions only of the inner support cylinder. This effectively increases the pressure as, by reducing the interface area, the force per unit area increases.

Abstract: At least one conductive metal foil is preliminarily bonded to an electrically insulating resinous substrate by squeezing the layers together under heat and pressure in a continuous mode, as by passing the layers through a nip roll to produce a partially cured resinous layer subjacent to the metal foil. The thus preliminarily bonded laminate is further processed in an autoclave, under heat and pressure, whereby the bonding layer between the metal and the substrate is cured. The laminate formed by this process is useful for metal-clad boards, particularly printed circuit boards. These boards may be either flexible or rigid.