Abstract: A high temperature semiconductor packaging, a method for making the same packaging are providing. The packaging comprises a mounting platform, a semiconductor die positioned above the platform and a layer of high temperature passivation coating.

Abstract: A radiation shielded semiconductor package for use in any variety of industries and applications is disclosed. In one embodiment, a radiation shielded semiconductor package comprises a radiation shielding base, one or more non-shielding sidewalls coupled to the shielding base, one or more radiation shielding flanges coupled to the sidewall, and one or more non-shielding coupling flanges coupled to the shielding flange. The base, the non-shielding sidewall, the shielding flange, and the non-shielding coupling flange define a device cavity, and at least one semiconductor device is positioned within the device cavity. A radiation shielding lid is coupled to the coupling flange and hermetically seals the semiconductor device within the device cavity. The shielding lid comprises shielding lid body and a non-shielding lid flange coupled to the lid body and is configured to couple to the coupling flange.

Abstract: A radiation shielded device for use in any variety of industries and applications is disclosed herein. In one embodiment, a radiation shielded device disclosed includes a radiation shielding base, one or more non-shielding sidewalls coupled to the shielding base, one or more radiation shielding flanges coupled to the sidewall, one or more non-shielding coupling flanges coupled to the shielding flange, wherein the base, the non-shielding sidewall, the shielding flange, and the non-shielding coupling flange define a device cavity, at least one semiconductor device positioned within the device cavity, and a radiation shielding lid coupled to the coupling flange and hermetically sealing the semiconductor device within the device cavity, the shielding lid having a shielding lid body and a non-shielding lid flange coupled to the lid body and configured to couple to the coupling flange.

Abstract: Human chemokine polypeptides and DNA/(RNA) encoding such chemokine polypeptides and a procedure for producing such polypeptides by recombinant techniques is disclosed. Also disclosed are methods for utilizing such chemokine polypeptides for the treatment of leukemia, tumors, chronic infections, autoimmune disease, fibrotic disorders, wound healing and psoriasis. Antagonists against such chemokine polypeptides and their use as a therapeutic to treat rheumatoid arthritis, autoimmune and chronic inflammatory and infective diseases, allergic reactions, prostaglandin-independent fever and bone marrow failure are also disclosed.

Abstract: Disclosed is a prosthetic device for replacing a portion of the incus when the stapes or a portion of the lenticular process is generally intact. The device comprises an opening for receiving the head of the stapes or a portion of the lenticular process and a channel for receiving the remnant portion of the incus. The opening and the channel are oriented to allow proper functioning of the ossicular chain.

Abstract: A game bird decoy is formed as a shell representative of the upper portion that is above the waterline of a floating game bird represented. There is an open cavity below the upper portion that terminates in a waterline rim. The head is formed folded out with two similar sides to be folded together and bonded to yield a realistic head. The head is attached to the body by inserting the neck into a hole provided in the body shell. A slit in the neck provides access to the cavity within for storage of line, weight, and the like. The decoy is formed from flat sheet stock of closed cellular foam, preferably, of polyethelene. The color and color patterns as desired on the final product are applied to the flat sheet stock before vacuum forming. Painting, printing and silk screen processes are used as dictated by batch quantity considerations.