Abstract: According to an exemplary embodiment, a method for site-specific trimming of a wafer to provide a target parameter value for a plurality of devices on the wafer includes performing a first measurement of a parameter at a subset of the number of devices on the wafer. The method further includes forming a top layer over the wafer after performing the first measurement. The method further includes performing a second measurement of the parameter at the subset of the devices on the wafer after forming the top layer. The method further includes determining an amount of the top layer to remove across the wafer to provide the target parameter value for the devices by utilizing the first and second measurements of the parameter. The method can be utilized to, for example, achieve a more uniform characteristic frequency for bulk acoustic wave (BAW) filters.