Abstract: A multi-component transistor structure includes components each comprising an individual, discrete, and separate component substrate and a component transistor. The component transistor includes a transistor element having a transistor element resistance. A component connection is disposed external to the transistor element and has a connection resistance. The component connection electrically connects the transistor elements in the components in parallel. The connection resistance is less than the transistor element resistance of at least one corresponding transistor element, less than an average of the transistor element resistances of all of the corresponding transistor elements, or less than the sum of all of the transistor element resistances of all of the corresponding transistor elements. The component transistors are functionally similar and at least one of the components is disposed on another different one of the components in a component stack.

Abstract: An embedded component stack includes a first metal layer, a first dielectric layer disposed on the first metal layer, a second metal layer disposed on the first dielectric layer, a first component disposed and embedded entirely within the first dielectric layer and entirely between the first metal layer and the second metal layer, a second dielectric layer disposed on the second metal layer, and a second component disposed on or embedded entirely within the second dielectric layer. The first and second components can be bare, unpackaged dies disposed over the metal layers by micro-transfer printing. The metal layers can be patterned and can be electrically connected to the components. The first component can be rotated with respect to the second component. Multiple components can be embedded in one or more of the dielectric layers.

Abstract: A multi-component transistor structure includes components each comprising an individual, discrete, and separate component substrate and a component transistor. The component transistor includes a transistor element having a transistor element resistance. A component connection is disposed external to the transistor element and has a connection resistance. The component connection electrically connects the transistor elements in the components in parallel. The connection resistance is less than the transistor element resistance of at least one corresponding transistor element, less than an average of the transistor element resistances of all of the corresponding transistor elements, or less than the sum of all of the transistor element resistances of all of the corresponding transistor elements. The component transistors are functionally similar and at least one of the components is disposed on another different one of the components in a component stack.

Abstract: An information handling system image builder server associated with a manufacturer supports remote access by customers through networked communications, such as the Internet, to create images for loading on information handling systems manufactured for the customers. An image creation engine of the server accesses an image library to build an image with image components selected in accordance with customer parameters. The image is built on hardware or virtual test information handling systems interfaced with the image creation engine. Customers may remotely upload custom image components to the library, such as custom applications and settings, and remotely test the operation of the image on the test information handling systems before promoting the built image to a manufacture environment for manufacture of information handling systems with the image.

Abstract: An information handling system image builder server associated with a manufacturer supports remote access by customers through networked communications, such as the Internet, to create images for loading on information handling systems manufactured for the customers. An image creation engine of the server accesses an image library to build an image with image components selected in accordance with customer parameters. The image is built on hardware or virtual test information handling systems interfaced with the image creation engine. Customers may remotely upload custom image components to the library, such as custom applications and settings, and remotely test the operation of the image on the test information handling systems before promoting the built image to a manufacture environment for manufacture of information handling systems with the image.