Abstract: Semiconductor substrate transfer treatment/processing tunnel-arrangement, containing such means, that thereby also during the uninterrupted operation thereof the uninterruptedly taking place of the establishing of a (sub) micrometer high layer of semiconductor substances with an optimum uniform height thereof upon the successive semiconductor substrate-sections, uninterruptedly displacing therethrough and such by means of through a strip-shaped supply-section of the uppertunnelclock in its central semiconductor section the uninterruptedly taking place of a supply of the combination of fluidic support-medium and parts of a semiconductor substance in a solid- or fluidic form thereof and in the thereupon following strip-shaped semiconductor treatment/processing section underneath a vibrating transducer-arrangement, located in a transducer-compartment of this block, the also by means of the in addition developed heat of this vibrating transducer the taking place of evaporation of this support-medium under an at-l

Abstract: The invention is related to a semiconductor chip, at-least also accomplished in a semiconductor installation, containing at-least also a long, relatively narrow semiconductor substrate transfer/processing tunnel-arrangement, wherein during its operation at-least also the taking place of successive semiconductor processings of the successive, typically uninterruptedly displacing semiconductor substrate-sections there through and whereby in a device behind its exit by means of dividing these successive semiconductor substrate-sections the accomplishing thereof.

Abstract: Installation (10) for processing of successive wafers (26) under pulsating double-floating condition within processing gaps (174) and (176) above and underneath such wafer of an at least almost entirely sealed-off processing chamber (24) by means of a reciprocating upper chamber wall (34) immediately above this wafer, and with wafer supply and discharge toward and from this chamber also under pulsating double-floating condition.

Abstract: Method of transporting and processing of substrates. Particularly, transporting the substrate in a double floating mode within a confined passageway and selectively rotating the substrate within the passageway by applying pressurized fluid medium across the planar surface of the substrate. Processing of the substrate may be accomplished during the rotating by directing processing agents such as cleaning medium, rinsing medium, developing agent, etching agent, and the like, onto a surface of the substrate.

Abstract: Method of transporting and processing of substrates, including wafers of the type used for semiconductors. Particularly, a method of flowing fluid medium longitudinally within a confined passageway so that the substrate is supported, transported and processed in a double floating condition without touching the walls of the passageway. The method is characterized by the restricting of flowing of fluid medium into the passageway, so as to guide the substrate during transport and processing by injecting pressurized coating medium into the passageway at a series of processing stations defined intermediate transport sections of said passageway.

Abstract: This invention relates to method and apparatus of transporting and coating substrates within a confined longitudinal passageway. The method is characterized by the transport and coating of substrates without human or mechanical contact. The method includes supplying a fluid medium into the confined passageway and discharging the fluid medium from the passageway, such that the moving fluid cushions while longitudinally transporting the substrate within the passageway.

Abstract: Module for processing advancing substrates including an elongated housing enclosing pairs of superposed transporters defining a longitudinal passage; a source of pressurized gaseous transport medium communicating with the longitudinal passage, so as to provide a free floating transport of the substrates through the passage; and a series of processing chambers interposed between the pairs of transporters, so that a non-processing side and a processing side of the advancing substrates are exposed within the processing chamber. A plurality of gaseous transport medium discharge ducts extends laterally across the longitudinal passage above and below the substrates so as to collect and remove excess gaseous transport medium, while assisting the advance of the substrates in the passage.

Abstract: Improved installation (10), whereby in a first section (22) coating (24) is applied on substrate (14), moving through a passage (16) under double floating condition, in a following section (26) a layer fluid (28) is applied on said layer coating (24) and in the following sections (30) and (32) the removal takes place of said fluid layer with thereafter a drying of the remaining coating layer.

Abstract: Method of transporting and processing substrates with developing agent within a confined passage. Pressurized fluid medium is supplied and discharged on both sides of the substrate via sequentially located fluid medium supply and discharge channels intersecting the top and bottom of the passage, such that the moving fluid medium cushions the substrate and both sides of the substrate remain free of the passage. Developing agent is introduced via a developing agent supply channel intersecting the passage.

Abstract: Improved process installation (10) for double floating transport and processing of substrates (30), consisting of successive transporters (18) with process slots (28) positioned in between and tape (80) as transporting means for said substrates (30) and whereby tensioning means (24), (96) and (104) prevent an unallowable deformation of the transporters (18) and tape (80) during the processing with accompanying heat development.

Abstract: Improved apparatus (10), including passage (22) for inter-cushion processing and transport of substrates (12) towards and from process modules (14) and (16) for main processing of said substrates (12) at non-atmospheric pressure in a series of successive process chambers (64), located in between successive processors/transporters (66), in which secondary processing and transport of said substrates (12) take place.

Abstract: Apparatus for applying a coating, particularly for coating and advancing a substrate within a longitudinal passage having a plurality of transversely arrayed gaseous medium supply channels and a plurality of vacuum discharge channels intersecting the passage. A plurality of transversely arrayed coating medium supply channels intersect a processing side of the passage adjacent the vacuum discharge channels. Also, a restriction gap is defined in the passage intermediate the coating material supply channels and the vacuum discharge channels so as to insure filling of a first coating passage with coating material.

Abstract: Improved apparatus (10), including passage (22) for inter-cushion processing and transport of substrates (12) towards and from process modules (14) and (16) for main processing of said substrates (12) at non-atmospheric pressure in a series of successive process chambers (64), located in between successive processors/transporters (66), in which secondary processing and transport of said substrates (12) take place.

Abstract: Method for applying a coating upon a substrate comprising:a. flowing gaseous medium longitudinally within confined passageway via a series of gaseous medium supply channels and vacuum discharge channels intersecting said passageway;b. introducing the substrate into an end of said passageway, so as to be supported and advanced, while being cushioned, by said flowing gaseous medium; whilec. injecting a pressurized coating medium into said passageway via a series of branched medium supply channels intersecting said passageway adjacent said gaseous medium supply channels and gaseous medium discharge channels, so as to fill locally the longitudinal passageway; whiled. restricting flowing of coating medium within said passageway by reducing the height of said passageway.

Abstract: Apparatus (10) for deposition of fluid and gaseous media on substrates (18), comprising a cabin (32), in which series of segments (34, 36, 38 . . . 68) are located aside a central passage (80, 96). Media, flowing through apertures between these segments towards and along substrates, passing through the passage, create micro-sized cushions (20, 22) aside such substrates for floating, transport and processing thereof.

Abstract: Substrates, particularly a method of transporting and coating substrates within a confined longitudinal passageway. The method is characterized by the transport and coating of the substrate without human or mechanical contact. The method includes supplying a fluid medium into the confined passageway and discharging the fluid medium from the passageway, such that the moving fluid medium cushions while longitudinally transporting the substrate within the passageway.

Abstract: An ink pen has master and slave ink reservoirs and an ink lock communicating with one or more capillary buffer channels inside the master reservoir and preventing air flow to the slave reservoir.