Patents by Inventor Edward C. Couble

Edward C. Couble has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroplating process
    Patent number: 6565731
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The process is characterized by a pretreatment sequence that includes contact of the substrate with a single solution containing a reducing agent and a polyelectrolyte. The use of the single solution decreases the incidence of interconnect defects in printed circuit manufacture.
    Type: Grant
    Filed: June 3, 1997
    Date of Patent: May 20, 2003
    Assignee: Shipley Company, L.L.C.
    Inventors: Edward C. Couble, Mark J. Kapeckas, Steven M. Florio, David L. Jacques
  • Method for replenishing baths
    Patent number: 6372055
    Abstract: Disclosed are methods for replenishing adhesion promoting baths from an unstable state without discarding the bath. Methods of adhesion promoting substrates, such as printed wiring boards, using the replenished baths are also disclosed.
    Type: Grant
    Filed: February 23, 2000
    Date of Patent: April 16, 2002
    Assignee: Shipley Company, L.L.C.
    Inventors: Joseph R. Montano, Kimberly B. Wynja, Edward C. Couble, Martin W. Bayes
  • Electroplating process
    Patent number: 6231619
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then dried by passing the substrates between opposing resilient rollers and preferably passed an air knife.
    Type: Grant
    Filed: December 11, 1995
    Date of Patent: May 15, 2001
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5858198
    Abstract: A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.
    Type: Grant
    Filed: September 8, 1997
    Date of Patent: January 12, 1999
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5738776
    Abstract: A process for electroplating a metal clad substrate by coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is saturated with an etchant for the metal cladding on the substrate to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.
    Type: Grant
    Filed: January 19, 1996
    Date of Patent: April 14, 1998
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5683565
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.
    Type: Grant
    Filed: May 23, 1996
    Date of Patent: November 4, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5626736
    Abstract: A process for electroplating a metal clad substrate by forming a sacrificial coating over the metal cladding and then coating the substrate with a coating of carbonaceous particles. The coating of particles is applied to the substrate from an aqueous dispersion and then the coating is contacted with an etchant for the sacrificial coating to undercut the carbonaceous coating and facilitate its removal from areas where plating is undesired.
    Type: Grant
    Filed: January 19, 1996
    Date of Patent: May 6, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5618400
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an unstable aqueous dispersion essentially free of a dispersing agent using physical dispersion means to maintain the stability of the dispersion.
    Type: Grant
    Filed: September 19, 1995
    Date of Patent: April 8, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Electroplating process
    Patent number: 5611905
    Abstract: A process for electroplating a substrate by coating the substrate with a coating of conductive particles. The coating of conductive particles is applied to the substrate from an aqueous dispersion containing a dissolution agent for metallic regions of the substrate. The dissolution agent removes the top surface of the metal as the conductive particle coating is formed thereby facilitating removal of the same from the metallic regions of the substrate.
    Type: Grant
    Filed: June 9, 1995
    Date of Patent: March 18, 1997
    Assignee: Shipley Company, L.L.C.
    Inventors: Steven M. Florio, Jeffrey P. Burress, Carl J. Colangelo, Edward C. Couble, Mark J. Kapeckas
  • Pretreatment process for electroless plating of polyimides
    Patent number: 5178956
    Abstract: A process for promoting the adhesion of metal to thermoplastic substrates such as polyimides. The improvement comprises conditioning the substrate by treating with a lactone and aqueous rinse prior to subsequent steps of etching and deposition of a metal coating. Use of the conditioner promotes increased adhesion between the substrate and the metal without loss of the cohesive integrity of the substrate throughout subsequent processing steps.
    Type: Grant
    Filed: October 3, 1989
    Date of Patent: January 12, 1993
    Assignee: Shipley Company Inc.
    Inventors: James Rychwalski, Paul J. Ciccolo, Edward C. Couble
  • Tin lead process
    Patent number: 5169692
    Abstract: A process for replenishing a tin-lead alloy displacement plating solution which comprises periodically adding complexing agent to the solution during use of the same to bring the total concentration of complexing agent to an amount sufficient to ensure adhesion of the deposit to its underlying substrate.
    Type: Grant
    Filed: November 19, 1991
    Date of Patent: December 8, 1992
    Assignee: Shipley Company Inc.
    Inventors: Edward C. Couble, Steven M. Florio, Richard F. Staniunas
  • Through-hole plating
    Patent number: 4515829
    Abstract: Compositions and process for the plating of through-holes in an epoxy printed circuit board base material in the manufacture of printed circuit boards. The treatment process is designed to increase adhesion between the epoxy board material and a subsequently deposited metal plate. The process is characterized, in part, by the use of an activated permanganate solution.
    Type: Grant
    Filed: October 14, 1983
    Date of Patent: May 7, 1985
    Assignee: Shipley Company Inc.
    Inventors: Cheryl A. Deckert, Edward C. Couble, William F. Bonetti