Abstract: Footwear providing enhanced protection against extreme landing impacts includes a sole having an elastomeric mid-sole with elastomeric pads combined in a heel recess thereof such that the pads act in series with each other and in parallel with the mid-sole during conjoint compression thereof. At least one of the pads includes a solid gel having a relatively high damping coefficient. In another embodiment, the heel of the mid-sole is replaced by a toroidal gas cushion and an elastomeric pad including a solid gel having a relatively high damping coefficient disposed in a central recess of the cushion such that the pad is recessed a selected distance below the upper surface of the cushion. The resilient pads may advantageously incorporate a plurality of gas-filled cells, and a solid gel pad may also be disposed in the mid-sole of the footwear below the ball of the wearer's foot for increased protection.

Abstract: Footwear providing enhanced protection against extreme landing impacts includes a sole having an elastomeric mid-sole with elastomeric pads combined in a heel recess thereof such that the pads act in series with each other and in parallel with the mid-sole during conjoint compression thereof. At least one of the pads includes a solid gel having a relatively high damping coefficient. In another embodiment, the heel of the mid-sole is replaced by a toroidal gas cushion and an elastomeric pad including a solid gel having a relatively high damping coefficient disposed in a central recess of the cushion such that the pad is recessed a selected distance below the upper surface of the cushion. The resilient pads may advantageously incorporate a plurality of gas-filled cells, and a solid gel pad may also be disposed in the mid-sole of the footwear below the ball of the wearer's foot for increased protection.

Abstract: Footwear providing enhanced protection against extreme landing impacts includes a sole having an elastomeric mid-sole with elastomeric pads combined in a heel recess thereof such that the pads act in series with each other and in parallel with the mid-sole during conjoint compression thereof. At least one of the pads includes a solid gel having a relatively high damping coefficient. In another embodiment, the heel of the mid-sole is replaced by a toroidal gas cushion and an elastomeric pad including a solid gel having a relatively high damping coefficient disposed in a central recess of the cushion such that the pad is recessed a selected distance below the upper surface of the cushion. The resilient pads may advantageously incorporate a plurality of gas-filled cells, and a solid gel pad may also be disposed in the mid-sole of the footwear below the ball of the wearer's foot for increased protection.

Abstract: A housing including a sleeve portion having an interior bend configured to receive a knuckle on a wearer's finger such that the housing can be securely mounted on the wearer's finger. The housing also includes a cavity configured to receive an electronics module therein, and a control access configured to align with controls of the electronics module such that the wearer can operate the electronics module when contained in the recess. The housing may include an electronics module such a watch or medical monitoring device.

Abstract: A method of providing sublayer contacts in vertical walled trenches is proposed. In accordance with the present invention, the phosphorus doped amorphous silicon is deposited at temperatures less than 570.degree. C. The conversion into the extremely large crystal low resistivity polysilicon is accomplished by a low temperature anneal at 400.degree. C. to 500.degree. C. for several hours and a short rapid thermal anneal (RTA) treatment at a high temperature approximately 850.degree. C. for twenty seconds. These two conversion heat treatments are done at sufficiently low thermal budget to prevent any significant dopant movement within a shallow junction transistor. After anneal, the excess low resistivity silicon is planarized away by known techniques such as chemical/mechanical polishing.

Abstract: An apparatus and method for characterizing lithography imaging to quickly optimize a lithography process is described. The apparatus consists of two lithography masks for use with an optical stepper, ion-beam or x-ray lithography tool. The first mask is used for creating topography on the wafer substrate, and is patterned with groups of large elements arranged in orthogonal and angular directions. The second mask is used for defining a periodic pattern over the large elements. Preferably, the periodic pattern is in the same order of dimension as the critical element on the integrated circuit. A method is provided for characterizing lithography tools which do not have lithography masks such as an electron beam exposure tool.

Abstract: A method which provides for a permanent planarization layer on a multilayer integrated circuit. The planarization layer resides above other circuit layers which reflect incident light. A layer of photoresist is formed over the planarization layers and imaged through a mask with circuit defining structure. During exposure of the photoresist, incident light passes through the planarization layer. Scattering from the boundary of the planarization layer and photoresist is minimized because the index of refraction of the planarization layer is substantially equal to the index of refraction of the photoresist. Light reflected from the underlaying layers is substantially absorbed by the planarization layer. Reduction of the reflected and scattered light results in improved resolution of developed images in photoresist.

Abstract: In a photoresist lift-off process for depositing metal on a semiconductor substrate, a protective coating of silicon is applied to an etched via hole prior to the metal deposition step. This prevents the formation of contaminant trapping voids and contaminated chemical residues which would otherwise occur at the base of the metal line subsequently deposited in the bottom of the via hole. The protective silicon layer, which has a thickness of from 100 to 300 angstroms, remains intact as a permanent part of the structure.

Abstract: A device for measuring the speed of a person while running along a surface is disclosed. A pressure switch or transducer located in a shoe senses when a foot of the runner is in contact with the surface and produces a foot contact signal having a duration proportional to the time the foot is in contact with the surface. A radio frequency transmitter is coupled to the pressure switch or transducer and transmits the foot contact signal. A radio frequency transmitter receives the foot contact signal transmitted by the frequency transmitter and a microprocessor coupled to the radio frequency receiver calculates, solely from the foot contact signal, an output speed signal representing the speed of the runner. A liquid crystal display coupled to the output of the microprocessor displays the speed of the runner in accordance with the output speed signal.

Abstract: A photoresist photolithographic process is disclosed which provides for a single development step to develop a dual layer photoresist for lift-off, reactive ion etching, or ion implantation processes requiring a precise aperture size at the top of the photoresist layer.The process involves the deposition of two compositionally similar layers, with the first layer having the characteristic of being soluble in a developer after exposure to light and baking, and the second layer having the characteristic of being insoluble in the same developer after having been exposed to light and baked. With these two distinct characteristics for the two layers of photoresist, the effective aperture for windows in the composite photoresist can be tightly controlled in its cross-sectional dimension in the face of large variations in the developer concentration and development time.

Abstract: A method making self-aligned semiconductors utilizing two resist masking steps to form a device; making one of the masks insoluable with respect to the other so that when a first part of the device is formed by a first mask, and a second part of the device is formed by the second masks, the parts are self-aligned when the first resist is dissolved.

Abstract: An improved sole for use with footwear is disclosed. The sole includes at least one layer of material which is adapted to be attached to an upper of the footwear. A distal flex groove is formed in the sole and is coextensive with a medial metatarsal-phalanges line which extends between the first and second metatarsal-phalanges joints. A proximal flex groove is also formed in the sole and extends substantially parallel to a lateral metatarsal-phalanges line which extends along the second through fifth metatarsal-phalanges joints. The proximal and distal grooves join on another at the medial edge of the sole adjacent the first metatarsal-phalanges joint.

Abstract: A shock absorbing sole member used in an athletic shoe having an upper and a sole is disclosed. The shock absorbing sole member is comprised of an insert member and elastomeric foam encasing the insert member. The insert member is formed of resilient plastic material and includes a plurality of transversely and longitudinally spaced discrete shock absorbing projections. The elastomeric foam has a low hardness, less than 70 on the Asker C scale.

Abstract: A resist system for semiconductor device fabrication comprised of bottom positive resist layer of a diazoquinone/novolak resist applied to a substrate and overcoated with a like or different diazoquinone/novolak top resist layer which has been sensitized with pyrene and/or its derivatives.

Abstract: An athletic shoe (10) having an upper (12) and a sole (14) is disclosed. The sole (14) includes an intermediate sole layer (16) of a resilient cushioning material. A bead (46) is disposed about the perimeter of the shoe in the heel spring section to enhance the heel stability.

Abstract: Resist images are hardened so that they are flow resistant at elevated temperatures by coating the image with a layer of a quinone-diazide hardening agent and heating the image to cause the agent to react with the resist and form a hardened image.