Patents by Inventor Edward C. Limberg

Edward C. Limberg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6455936
    Abstract: An integrated circuit assembly includes a base board, an interposer, and an array of solder balls electrically and structurally interconnecting the interposer and the base board. The interposer has a backbone layer having a backbone stiffness, a first compliant layer affixed to the backbone layer between the backbone layer and the integrated circuit and having a first-layer stiffness of less than the backbone stiffness, and a second compliant layer affixed to the backbone layer between the backbone layer and the base board and having a second-layer stiffness of less than the backbone stiffness. An integrated circuit is supported on the interposer. The integrated circuit includes integrated-circuit bonding pads thereon and a bonding pad protective coating overlying the integrated-circuit bonding pads. An electrical interconnect extends from the integrated circuit to at least one of the solder balls, and a cover overlies and protects the integrated circuit.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: September 24, 2002
    Assignee: The Boeing Company
    Inventors: Ching-Ping Lo, Gregory L. Mayhew, Gustavo V. Catipon, Richard L. Singleton, Edward C. Limberg